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Ji-Hoon Kang
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Journal Articles

A Multi-GPU Based Real-Time Large-Eddy Simulation of Urban Wind in Seoul

Mingyu Yang, Geunwoo Oh, Tiantian Xu, Jungwoo Kim, Ji-Hoon Kang, Jung-Il Choi
Journal: Journal of Fluids Engineering
Publisher: ASME
Article Type: Photo Gallery
J. Fluids Eng. July 2024, 146(7): 070904.
Paper No: FE-23-1475
https://doi.org/10.1115/1.4065303
Published Online: April 16, 2024
View Articletitled, A Multi-GPU Based Real-Time Large-Eddy Simulation of Urban Wind in Seoul
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Topics: Cities, Graphics processing units, Large eddy simulation, Wind
Journal Articles

EPFM Analyses of a Complex Crack in Dissimilar Metal Welded Pipes

Ji-Hoon Kang, Belal Almomani, Yoon-Suk Chang
Journal: Journal of Pressure Vessel Technology
Publisher: ASME
Article Type: Research-Article
J. Pressure Vessel Technol. February 2022, 144(1): 011505.
Paper No: PVT-20-1288
https://doi.org/10.1115/1.4052398
Published Online: October 8, 2021
View Articletitled, EPFM Analyses of a Complex Crack in Dissimilar Metal Welded Pipes
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Topics: Finite element analysis, Fracture (Materials), Pipes, Tension, Metals, Pressure, Materials properties, Displacement
Proceedings Papers

Effects of Adhesion and Friction on the Pattern Transfer in Nanoimprint Lithography: A Molecular Dynamics Simulation

Ji-Hoon Kang, Kwang-Seop Kim, Kyung-Woong Kim
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 773-774, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-63652
https://doi.org/10.1115/WTC2005-63652
View Paper titled, Effects of Adhesion and Friction on the Pattern Transfer in Nanoimprint Lithography: A Molecular Dynamics Simulation
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Topics: Adhesion, Friction, Lithography, Molecular dynamics simulation, Polymer films, Molecular dynamics, Simulation, Simulation results
Proceedings Papers

A Study on Adhesion Between Mold and Resist in Nanoimprint Lithography

Kwang-Seop Kim, Ji-Hoon Kang, Kyung-Woong Kim
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 767-768, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-63597
https://doi.org/10.1115/WTC2005-63597
View Paper titled, A Study on Adhesion Between Mold and Resist in Nanoimprint Lithography
Open the PDF for A Study on Adhesion Between Mold and Resist in Nanoimprint Lithography in another window
Topics: Adhesion, Lithography, Adhesives, Fracture (Materials), Fracture (Process), Friction, Quartz