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Jiahui Yang
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Journal Articles

A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging

Xingjun Yao, Weijie Jiang, Jiahui Yang, Junjie Fang, Wenjun Zhang
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041003.
Paper No: EP-20-1094
DOI: https://doi.org/10.1115/1.4052275
Published Online: November 22, 2021
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Topics: Computational fluid dynamics, Flip-chip, Flip-chip packages, Flow (Dynamics), Simulation, Solders, Surface energy, Uncertainty, Shapes, Packaging
Proceedings Papers

Lateral Compressive Properties of Paper Tube

Mitsunori Suda, Jiahui Yang, Takanori Kitamura, Kanta Ito, Kenji Wada, Zhiyuan Zhang, Yuqiu Yang, Hiroyuki Hamada
Proc. ASME. IMECE2014, Volume 14: Emerging Technologies; Engineering Management, Safety, Ethics, Society, and Education; Materials: Genetics to Structures, V014T11A045, November 14–20, 2014
Paper No: IMECE2014-37923
DOI: https://doi.org/10.1115/IMECE2014-37923
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Topics: Anisotropy, Compression, Computer simulation, Computer software, Construction, Displacement, Emergencies, Fracture (Materials), Fracture (Process), Machinery