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Proceedings Papers

Parametric Study of Thermal Performance of a Plastic Ball Grid Array, Single Package Technology for Automotive Applications

K. Ramakrishna, J. R. Trent
Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 13-21, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1210
https://doi.org/10.1115/IMECE1997-1210
View Paper titled, Parametric Study of Thermal Performance of a Plastic Ball Grid Array, Single Package Technology for Automotive Applications
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Topics: Automotive industry, Ball-Grid-Array packaging, Temperature, Junctions, Printed circuit boards, Computational fluid dynamics, Thermal conductivity, Heat transfer, Transients (Dynamics), Energy dissipation
Proceedings Papers

Impact of On-Die Discrete Heating on Thermal Performance Characteristics of Silicon Based IC Electronic Packages

V. H. Adams, K. Ramakrishna
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 99-106, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0922
https://doi.org/10.1115/IMECE1999-0922
View Paper titled, Impact of On-Die Discrete Heating on Thermal Performance Characteristics of Silicon Based IC Electronic Packages
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Topics: Electronic packages, Heating, Performance characterization, Silicon, Heat, Temperature, Thermal characterization, Ball-Grid-Array packaging, Engineering simulation, Junctions
Proceedings Papers

Prediction of Thermal Performance of Flip-Chip-Plastic Ball Grid Array (FC-PBGA) Packages: Effect of Die Size

K. Ramakrishna, T.-Y. Lee
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 139-148, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24387
https://doi.org/10.1115/IMECE2001/HTD-24387
View Paper titled, Prediction of Thermal Performance of Flip-Chip-Plastic Ball Grid Array (FC-PBGA) Packages: Effect of Die Size
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Topics: Ball-Grid-Array packaging, Junctions, Mixed convection, Computation, Computational fluid dynamics, Databases, Flip-chip, Heat transfer, Thermal resistance
Journal Articles

Non-Darcy Mixed Convection With Thermal Dispersion in a Saturated Porous Medium

V. V. Sobha, R. Y. Vasudeva, K. Ramakrishna, K. Hema Latha
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. January 2010, 132(1): 014501.
https://doi.org/10.1115/1.3194761
Published Online: October 23, 2009
View Article titled, Non-Darcy Mixed Convection With Thermal Dispersion in a Saturated Porous Medium
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Topics: Flow (Dynamics), Melting, Mixed convection, Porous materials, Forced convection, Temperature, Inertia (Mechanics), Heat transfer
Proceedings Papers

An Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array (FC-PBGA) Packages

K. Ramakrishna, T.-Y. Tom Lee
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 709-719, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42397
https://doi.org/10.1115/IMECE2003-42397
View Paper titled, An Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array (FC-PBGA) Packages
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Topics: Ball-Grid-Array packaging, Flat heat pipes, Thermal conductivity, Printed circuit boards, Thermal resistance, Junctions, Ceramics, Computational fluid dynamics, Copper, Design
Journal Articles

Special Issue With Contributions From ITherm 2004

K. Ramakrishna, Bahgat G. Sammakia, J. Richard Culham, Yogendra K. Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Foreword
J. Electron. Packag. June 2006, 128(2): 101.
https://doi.org/10.1115/1.2188607
Published Online: June 1, 2006
View Article titled, Special Issue With Contributions From ITherm 2004
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Topics: Electronic packaging, Packaging, Thermal management, Heat transfer
Journal Articles

Optimization Study for a Parallel Plate Impingement Heat Sink

Amit Shah, Bahgat G. Sammakia, K. Srihari, K. Ramakrishna
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 311–318.
https://doi.org/10.1115/1.2351893
Published Online: February 6, 2006
View Article titled, Optimization Study for a Parallel Plate Impingement Heat Sink
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Topics: Design, Heat sinks, Fins, Pressure drop, Optimization
Journal Articles

Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array Packages

K. Ramakrishna, Fellow ASME,, T.-Y. Tom Lee, Mem. ASME,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 449–456.
https://doi.org/10.1115/1.1827260
Published Online: January 24, 2005
View Article titled, Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array Packages
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Topics: Flat heat pipes, Forced convection, Mixed convection, Natural convection, Printed circuit boards, Thermal conductivity, Thermal resistance, Heat transfer, Copper, Junctions
Journal Articles

Prediction of Thermal Performance of Wire-Bonded Plastic Ball Grid Array Package for Underhood Automotive Applications

K. Ramakrishna, Fellow ASME, J. R. Trent
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 447–455.
https://doi.org/10.1115/1.1602710
Published Online: September 17, 2003
View Article titled, Prediction of Thermal Performance of Wire-Bonded Plastic Ball Grid Array Package for Underhood Automotive Applications
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Topics: Junctions, Molding, Printed circuit boards, Temperature, Thermal conductivity, Natural convection, Wire, Automotive industry, Emissivity
Journal Articles

Evaluation of Smear and Its Effect on the Mechanical Integrity of Plated Through Hole-Inner Plane Interface in Thick Printed Wiring Boards

R. Venkatraman, K. Ramakrishna, Mem. ASME, K. Knadle, W. T. Chen, Fellow ASME, G. C. Haddon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 6–15.
https://doi.org/10.1115/1.1326437
Published Online: July 1, 2000
View Article titled, Evaluation of Smear and Its Effect on the Mechanical Integrity of Plated Through Hole-Inner Plane Interface in Thick Printed Wiring Boards
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Topics: Copper, Double refraction, Drilling, Drills (Tools), Epoxy resins, Failure, Failure analysis, Finite element analysis, Fracture (Materials), Glass
Journal Articles

The Impact of Interfacial Adhesion on PTH and Via Stress State

G. Subbarayan, K. Ramakrishna, B. G. Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 260–267.
https://doi.org/10.1115/1.2792247
Published Online: December 1, 1997
View Article titled, The Impact of Interfacial Adhesion on PTH and Via Stress State
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Topics: Adhesion, Stress, Laminates, Fracture (Materials), Fracture (Process), Plating, Drills (Tools), Finite element analysis, Junctions, Manufacturing
Journal Articles

An Analysis of Shrinkage Porosity in Aluminum Ball Bonding Process

L. J. Huang, K. Ramakrishna, P. S. Ayyaswamy, I. M. Cohen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1989, 111(3): 199–206.
https://doi.org/10.1115/1.3226534
Published Online: September 1, 1989
View Article titled, An Analysis of Shrinkage Porosity in Aluminum Ball Bonding Process
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Topics: Aluminum, Bonding, Porosity, Shrinkage (Materials), Alloys, Metals, Density, Solidification, Accounting, Geometry
Journal Articles

Temperature Response of a Heated Cylinder Subject to Side Cooling: Asymptotic and Numerical Solutions

K. Ramakrishna, I. M. Cohen, P. S. Ayyaswamy
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. August 1989, 111(3): 592–597.
https://doi.org/10.1115/1.3250723
Published Online: August 1, 1989
View Article titled, Temperature Response of a Heated Cylinder Subject to Side Cooling: Asymptotic and Numerical Solutions
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Topics: Cooling, Cylinders, Temperature, Heat flux, Bonding, Heat, Heat conduction, Heat losses, Heat transfer, Manufacturing
Journal Articles

Turbulent Heat Transfer by Free Convection from a Rough Surface

K. Ramakrishna, K. N. Seetharamu, P. K. Sarma
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. November 1978, 100(4): 727–729.
https://doi.org/10.1115/1.3450886
Published Online: November 1, 1978
View Article titled, Turbulent Heat Transfer by Free Convection from a Rough Surface
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Topics: Natural convection, Surface roughness, Turbulent heat transfer