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K. C. Hung
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Journal Articles

Effect of Underfill Entrapment on the Reliability of Flip-Chip Solder Joint

Y. C. Chan, M. O. Alam, K. C. Hung, H. Lu, C. Bailey
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 541–545.
https://doi.org/10.1115/1.1756590
Published Online: January 24, 2005
View Article titled, Effect of Underfill Entrapment on the Reliability of Flip-Chip Solder Joint
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Topics: Bonding, Flip-chip, Flip-chip devices, Flow (Dynamics), Reliability, Solder joints, Solders, Modeling
Journal Articles

Correlation Between the Mechanical Strength and Curing Condition of No-Flow Flip Chip Assemblies

C. W. Tang, Y. C. Chan, K. C. Hung, P. L. Tu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 397–402.
https://doi.org/10.1115/1.1510865
Published Online: December 12, 2002
View Article titled, Correlation Between the Mechanical Strength and Curing Condition of No-Flow Flip Chip Assemblies
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Topics: Flip-chip devices, Flow (Dynamics), Shear strength, Tin, Heating, Flip-chip assemblies, Hardening (Curing), Solders, Manufacturing, Strength (Materials)
Journal Articles

Vibration of Thick Prismatic Structures With Three-Dimensional Flexibilities

K. M. Liew, K. C. Hung, M. K. Lim
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Papers
J. Appl. Mech. September 1998, 65(3): 619–625.
https://doi.org/10.1115/1.2789103
Published Online: September 1, 1998
View Article titled, Vibration of Thick Prismatic Structures With Three-Dimensional Flexibilities
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Topics: Vibration, Dimensions, Free vibrations, Frequency response, Mode shapes, Plate theory, Polynomials, Shapes, Wall thickness
Journal Articles

Vibration Characteristics of Simply Supported Thick Skew Plates in Three-Dimensional Setting

K. M. Liew, K. C. Hung, M. K. Lim
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Papers
J. Appl. Mech. December 1995, 62(4): 880–886.
https://doi.org/10.1115/1.2896015
Published Online: December 1, 1995
View Article titled, Vibration Characteristics of Simply Supported Thick Skew Plates in Three-Dimensional Setting
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Topics: Plates (structures), Vibration, Elasticity, Corners (Structural elements), Displacement, Eigenvalues, Free vibrations, Kinetic energy, Shear (Mechanics), Stress singularity
Journal Articles

Vibration of Stress-Free Hollow Cylinders of Arbitrary Cross Section

K. M. Liew, K. C. Hung, M. K. Lim
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Papers
J. Appl. Mech. September 1995, 62(3): 718–724.
https://doi.org/10.1115/1.2897005
Published Online: September 1, 1995
View Article titled, Vibration of Stress-Free Hollow Cylinders of Arbitrary Cross Section
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Topics: Cylinders, Stress, Vibration, Cross section (Physics), Displacement, Elasticity, Mode shapes
Journal Articles

Free Vibration Studies on Stress-Free Three-Dimensional Elastic Solids

K. M. Liew, K. C. Hung, M. K. Lim
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Papers
J. Appl. Mech. March 1995, 62(1): 159–165.
https://doi.org/10.1115/1.2895897
Published Online: March 1, 1995
View Article titled, Free Vibration Studies on Stress-Free Three-Dimensional Elastic Solids
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Topics: Free vibrations, Solids, Stress, Displacement, Eigenvalues, Elasticity, Mode shapes, Plates (structures), Polynomials, Vibration