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Proceedings Papers

Study of Time and Temperature Dependency of Bulk Modulus for Molding Compound by Transient Bulk Creep Experiments

M. D. Patel, K. M. B. Jansen, L. J. Ernst, J. Zhou, C. Bohm

Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 275-279, November 11–15, 2007

Publisher: American Society of Mechanical Engineers

Paper No: IMECE2007-42852

https://doi.org/10.1115/IMECE2007-42852

View Paper titled, Study of Time and Temperature Dependency of Bulk Modulus for Molding Compound by Transient Bulk Creep Experiments

Topics: Bulk modulus, Creep, Molding, Temperature, Transients (Dynamics), Pressure, Compression, Epoxy adhesives, Epoxy resins, Relaxation (Physics)

Journal Articles

Finite Thickness Influence on Spherical and Conical Indentation on Viscoelastic Thin Polymer Film

V. Gonda, J. den Toonder, J. Beijer, G. Q. Zhang, L. J. Ernst

Publisher: ASME

J. Electron. Packag. March 2005, 127(1): 33–37.

https://doi.org/10.1115/1.1846065

Published Online: March 21, 2005

View Article titled, Finite Thickness Influence on Spherical and Conical Indentation on Viscoelastic Thin Polymer Film

Topics: Polymer films, Thin films, Testing, Creep, Nanoindentation, Stress, Temperature, Viscoelasticity

Journal Articles

State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films

K. M. B. Jansen, V. Gonda, L. J. Ernst, H. J. L. Bressers, G. Q. Zhang

Publisher: ASME

J. Electron. Packag. December 2005, 127(4): 530–536.

https://doi.org/10.1115/1.2070092

Published Online: December 22, 2004

View Article titled, State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films

Topics: Deflection, Electromagnetic scattering, Film thickness, Nanoindentation, Polymer films, Polymers, Radiation scattering, Scattering (Physics), Stress, Thermomechanics

Journal Articles

A Micromechanics-Based Vapor Pressure Model in Electronic Packages

X. J. Fan, J. Zhou, G. Q. Zhang, L. J. Ernst

Publisher: ASME

J. Electron. Packag. September 2005, 127(3): 262–267.

https://doi.org/10.1115/1.1939027

Published Online: June 26, 2004

View Article titled, A Micromechanics-Based Vapor Pressure Model in Electronic Packages

Topics: Vapor pressure, Temperature, Micromechanics (Engineering), Vapors

Journal Articles

Thermal and Mechanical Simulation and Experiments in Micro-electronics and Microsystems

L. J. Ernst, Guest Editor, G. Q. Zhang, Guest Editor

Publisher: ASME

J. Electron. Packag. December 2003, 125(4): 465.

https://doi.org/10.1115/1.1634590

Published Online: December 15, 2003

View Article titled, Thermal and Mechanical Simulation and Experiments in Micro-electronics and Microsystems

Topics: Engineering simulation, Microelectromechanical systems, Microelectronic devices, Optimization, Thermal management, Computer simulation, Failure analysis, Micromechanical devices, Packaging

Journal Articles

Solders Fatigue Prediction Using Interfacial Boundary Volume Criterion

X. J. Zhao, G. Q. Zhang, J. F. J. M. Caers, L. J. Ernst

Publisher: ASME

J. Electron. Packag. December 2003, 125(4): 582–588.

https://doi.org/10.1115/1.1604160

Published Online: December 15, 2003

View Article titled, Solders Fatigue Prediction Using Interfacial Boundary Volume Criterion

Topics: Deformation, Fatigue, Fatigue life, Solder joints, Solders, Modeling, Damage, Cycles, Packaging

Journal Articles

Thermally Induced Delamination Buckling of a Thin Metal Layer on a Ceramic Substrate

C. J. Liu, L. J. Ernst, G. Wisse, G. Q. Zhang, M. Vervoort

Publisher: ASME

J. Electron. Packag. December 2003, 125(4): 512–519.

https://doi.org/10.1115/1.1604152

Published Online: December 15, 2003

View Article titled, Thermally Induced Delamination Buckling of a Thin Metal Layer on a Ceramic Substrate

Topics: Buckling, Ceramics, Copper, Delamination, Finite element methods, Finite element model, Simulation, Stress, Temperature, Deformation

Journal Articles

Time- and Temperature-Dependent Thermo-Mechanical Modeling of a Packaging Molding Compound and its Effect on Packaging Process Stresses

L. J. Ernst, G. Q. Zhang, K. M. B. Jansen, H. J. L. Bressers

Publisher: ASME

J. Electron. Packag. December 2003, 125(4): 539–548.

https://doi.org/10.1115/1.1604156

Published Online: December 15, 2003

View Article titled, Time- and Temperature-Dependent Thermo-Mechanical Modeling of a Packaging Molding Compound and its Effect on Packaging Process Stresses

Topics: Creep, Molding, Poisson ratio, Stress, Temperature, Relaxation (Physics), Packaging

Journal Articles

Packaging Induced Die Stresses—Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding Compound

W. D. van Driel, J. H. J. Janssen, G. Q. Zhang, D. G. Yang, L. J. Ernst

Publisher: ASME

J. Electron. Packag. December 2003, 125(4): 520–526.

https://doi.org/10.1115/1.1604153

Published Online: December 15, 2003

View Article titled, Packaging Induced Die Stresses—Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding Compound

Topics: Anisotropy, Molding, Packaging, Stress, Temperature, Viscoelasticity, Finite element analysis

Journal Articles

Response Surface Modeling for Nonlinear Packaging Stresses

W. D. van Driel, G. Q. Zhang, J. H. J. Janssen, L. J. Ernst

Publisher: ASME

J. Electron. Packag. December 2003, 125(4): 490–497.

https://doi.org/10.1115/1.1604149

Published Online: December 15, 2003

View Article titled, Response Surface Modeling for Nonlinear Packaging Stresses

Topics: Design, Finite element model, Packaging, Response surface methodology, Stress, Temperature, Optimization, Modeling, Solders, Testing

Journal Articles

Mechanical Modeling and Characterization of the Curing Process of Underfill Materials

L. J. Ernst, C. van ’t Hof, D. G. Yang, M. S. Kiasat, G. Q. Zhang, H. J. L. Bressers, J. F. J. Caers, A. W. J. den Boer, J. Janssen

Publisher: ASME

J. Electron. Packag. June 2002, 124(2): 97–105.

https://doi.org/10.1115/1.1459471

Published Online: May 2, 2002

View Article titled, Mechanical Modeling and Characterization of the Curing Process of Underfill Materials

Topics: Hardening (Curing), Relaxation (Physics), Shrinkage (Materials), Stress, Modeling, Flip-chip devices, Polymers, Storage, Deformation

Journal citation

NARROW

Study of Time and Temperature Dependency of Bulk Modulus for Molding Compound by Transient Bulk Creep Experiments

Finite Thickness Influence on Spherical and Conical Indentation on Viscoelastic Thin Polymer Film

State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films

A Micromechanics-Based Vapor Pressure Model in Electronic Packages

Thermal and Mechanical Simulation and Experiments in Micro-electronics and Microsystems

Solders Fatigue Prediction Using Interfacial Boundary Volume Criterion

Thermally Induced Delamination Buckling of a Thin Metal Layer on a Ceramic Substrate

Time- and Temperature-Dependent Thermo-Mechanical Modeling of a Packaging Molding Compound and its Effect on Packaging Process Stresses

Packaging Induced Die Stresses—Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding Compound

Response Surface Modeling for Nonlinear Packaging Stresses

Mechanical Modeling and Characterization of the Curing Process of Underfill Materials

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