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Lauren M. Boteler
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Journal Articles

Metallic Phase Change Material's Microstructural Stability Under Repetitive Melting/Solidification Cycles

Rafael Báez, Luis E. González, Manny X. de Jesús-López, Pedro O. Quintero, Lauren M. Boteler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031110.
Paper No: EP-20-1013
https://doi.org/10.1115/1.4047063
Published Online: May 13, 2020
View Articletitled, Metallic Phase Change Material's Microstructural Stability Under Repetitive Melting/Solidification Cycles
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Topics: Cycles, Melting, Metals, Solidification, Temperature, Alloys, Stability
Proceedings Papers

Metallic PCM’s Microstructural Stability Under Repetitive Melting/Solidification Cycles

Rafael Báez, Luis E. González, Pedro O. Quintero, Lauren M. Boteler
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A005, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6385
https://doi.org/10.1115/IPACK2019-6385
View Paper titled, Metallic PCM’s Microstructural Stability Under Repetitive Melting/Solidification Cycles
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Topics: Cooling, Cycles, Melting, Solidification, Stability, Thermal stability, Alloys, Metals, Temperature, Thermal management
Proceedings Papers

Integrated Vapor Chamber Heat Spreader for Power Module Applications

Clayton L. Hose, Dimeji Ibitayo, Lauren M. Boteler, Jens Weyant, Bradley Richard
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A013, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74132
https://doi.org/10.1115/IPACK2017-74132
View Paper titled, Integrated Vapor Chamber Heat Spreader for Power Module Applications
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Topics: Flat heat pipes, Vapors, Heat, Heat flux, Copper, Electronics, Flux (Metallurgy), Thermal resistance, Flow (Dynamics), Modeling
Proceedings Papers

Voiding Effects on the Thermal Response of Metallic Phase Change Materials Under Pulsed Power Loading

David Gonzalez-Nino, Lauren M. Boteler, Nicholas R. Jankowski, Dimeji Ibitayo, Pedro O. Quintero
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74118
https://doi.org/10.1115/IPACK2017-74118
View Paper titled, Voiding Effects on the Thermal Response of Metallic Phase Change Materials Under Pulsed Power Loading
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Topics: Phase change materials, Heat, Silicon nitride ceramics, Temperature, Cooling, Cooling systems, Cycles, Inspection, Optical quality control, Temperature profiles
Proceedings Papers

Numerical Evaluation of Multiple Phase Change Materials for Pulsed Electronics Applications

David Gonzalez-Nino, Lauren M. Boteler, Dimeji Ibitayo, Nicholas R. Jankowski, Pedro O. Quintero
Proc. ASME. HT2016, Volume 2: Heat Transfer in Multiphase Systems; Gas Turbine Heat Transfer; Manufacturing and Materials Processing; Heat Transfer in Electronic Equipment; Heat and Mass Transfer in Biotechnology; Heat Transfer Under Extreme Conditions; Computational Heat Transfer; Heat Transfer Visualization Gallery; General Papers on Heat Transfer; Multiphase Flow and Heat Transfer; Transport Phenomena in Manufacturing and Materials Processing, V002T11A004, July 10–14, 2016
Publisher: American Society of Mechanical Engineers
Paper No: HT2016-7223
https://doi.org/10.1115/HT2016-7223
View Paper titled, Numerical Evaluation of Multiple Phase Change Materials for Pulsed Electronics Applications
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Topics: Electronics, Phase change materials, Heat, Tin, Transients (Dynamics), Stress, Thermal conductivity, Absorption, Finite difference methods, Gallium
Journal Articles

Measurement of High-Performance Thermal Interfaces Using a Reduced Scale Steady-State Tester and Infrared Microscopy

Andrew N. Smith, Nicholas R. Jankowski, Lauren M. Boteler
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. April 2016, 138(4): 041301.
Paper No: HT-15-1199
https://doi.org/10.1115/1.4032172
Published Online: January 20, 2016
View Articletitled, Measurement of High-Performance Thermal Interfaces Using a Reduced Scale Steady-State Tester and Infrared Microscopy
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Topics: Heat, Interfacial thermal resistance, Steady state, Temperature, Uncertainty, Microscopy, Thermal resistance, Temperature gradient, Heat flux