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Mark Schultz
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Proceedings Papers
Shidong Li, Bakul Parikh, Chelsea Savoy, Daniel Kuchta, Guillaume Jutras, Harry Bagheri, Hilton Toy, Joe Ross, Ken-Ichi Akasofu, Mark Kapfhammer, Mark Schultz, Steven Ostrander, Thomas Wassick
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97455
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011005.
Paper No: EP-19-1099
Published Online: June 4, 2020
Proceedings Papers
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6444
Journal Articles
Mark Schultz, Fanghao Yang, Evan Colgan, Robert Polastre, Bing Dang, Cornelia Tsang, Michael Gaynes, Pritish Parida, John Knickerbocker, Timothy Chainer
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2016, 138(2): 021005.
Paper No: EP-15-1084
Published Online: April 25, 2016
Proceedings Papers
Fanghao Yang, Mark Schultz, Pritish Parida, Evan Colgan, Robert Polastre, Bing Dang, Cornelia Tsang, Michael Gaynes, John Knickerbocker, Timothy Chainer
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A006, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48341
Proceedings Papers
Mark Schultz, Fanghao Yang, Evan Colgan, Robert Polastre, Bing Dang, Cornelia Tsang, Michael Gaynes, Pritish Parida, John Knickerbocker, Timothy Chainer
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A007, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48348
Proceedings Papers
Pritish R. Parida, Timothy Chainer, Madhusudan Iyengar, Milnes David, Mark Schultz, Michael Gaynes, Vinod Kamath, Bejoy Kochuparambil, Robert Simons, Roger Schmidt
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 1127-1139, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-88957