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Proceedings Papers

Thermal Analysis of Compact Electronic Equipment With Cooling Fan

Katsumi Hisano, Hideo Iwasaki, Masaru Ishizuka, Sadao Makita
Proc. ASME. IMECE96, Application of CAE/CAD to Electronic Systems, 89-92.1, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1007
https://doi.org/10.1115/IMECE1996-1007
View Paper titled, Thermal Analysis of Compact Electronic Equipment With Cooling Fan
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Topics: Cooling, Electronic equipment, Thermal analysis, Heat conduction, Numerical analysis, Air flow, Computer simulation, Computers, Finite volume methods, Printed circuit boards
Proceedings Papers

Application of the Thermal Network Method to the Transient Thermal Analysis of Multichip Modules

Masaru Ishizuka, Hideo Iwasaki
Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 75-81, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1216
https://doi.org/10.1115/IMECE1997-1216
View Paper titled, Application of the Thermal Network Method to the Transient Thermal Analysis of Multichip Modules
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Topics: Multi-chip modules, Thermal analysis, Transients (Dynamics), Density, Design, Electronic circuits, Energy dissipation, Heat, Packaging, Reliability
Proceedings Papers

Micro Channel Heat Exchanger for Cooling Electrical Equipment

Koichiro Kawano, Ko Minakami, Hideo Iwasaki, Masaru Ishizuka
Proc. ASME. IMECE98, Heat Transfer: Volume 3 — Application of Heat Transfer in Equipment, Systems, and Education, 173-180, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0650
https://doi.org/10.1115/IMECE1998-0650
View Paper titled, Micro Channel Heat Exchanger for Cooling Electrical Equipment
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Topics: Cooling, Electrical components, Heat exchangers, Microchannels, Pressure, Heat, Heat transfer, Computer simulation, Design, Integrated circuits
Proceedings Papers

Thermal Analysis of Stacked Ni-MH Battery

Katsumi Hisano, Hideo Iwasaki, Masaru Ishizuka, Tetsuya Yamane
Proc. ASME. IMECE99, Heat Transfer: Volume 1, 333-337, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-1001
https://doi.org/10.1115/IMECE1999-1001
View Paper titled, Thermal Analysis of Stacked Ni-MH Battery
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Topics: Nickel metal hydride batteries, Thermal analysis, Stress, Pallets, Temperature, Batteries, Numerical analysis, Transportation systems
Proceedings Papers

CFD - Based Investigation of Effects of Obstruction in Front of Small Axial Cooling Fan and Deterioration of Supply Flow Rate

Tetsushi Fukuda, Yukio Masuda, Takashi Fukue, Yasuhiro Sugimoto, Tomoyuki Hatakeyama, Masaru Ishizuka, Katsuhiro Koizumi
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A007, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72976
https://doi.org/10.1115/IPACK2021-72976
View Paper titled, CFD - Based Investigation of Effects of Obstruction in Front of Small Axial Cooling Fan and Deterioration of Supply Flow Rate
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Topics: Computational fluid dynamics, Cooling, Flow (Dynamics), Impellers, Density, Electronic equipment, Packaging, Fans, Flow visualization, Pressure
Proceedings Papers

Flow and Thermal Resistance Network Modeling of Finned Heat Sinks With Bypass Mounted in Rectangular Enclosure

Masaya Fukada, Takashi Fukue, Yasuhiro Sugimoto, Tomoyuki Hatakeyama, Masaru Ishizuka
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A006, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72975
https://doi.org/10.1115/IPACK2021-72975
View Paper titled, Flow and Thermal Resistance Network Modeling of Finned Heat Sinks With Bypass Mounted in Rectangular Enclosure
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Topics: Flow (Dynamics), Heat sinks, Modeling, Thermal resistance, Electronic equipment, Cooling, Design, Forced convection, Heat transfer, Network analysis
Proceedings Papers

Studies on Natural Convection Induced Flow and Thermal Behavior Inside Electronic Equipment Cabinet Model

Masaru Ishizuka, Guoyi Peng, Shinji Hayama
Proc. ASME. IMECE2001, Heat Transfer: Volume 5 — Computational, Aerospace and Environmental Heat Transfer, 171-176, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24299
https://doi.org/10.1115/IMECE2001/HTD-24299
View Paper titled, Studies on Natural Convection Induced Flow and Thermal Behavior Inside Electronic Equipment Cabinet Model
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Topics: Electronic equipment, Flow (Dynamics), Heat flux, Natural convection
Proceedings Papers

On Simple Prediction Method for Thermal Contact Resistance Between Wavy Surfaces With Thermal Interface Material Under Low Mean Nominal Contact Pressure (Fundamental Study Based on 1-D Model)

Toshio Tomimura, Yasushi Koito, Taewan Do, Masaru Ishizuka, Tomoyuki Hatakeyama
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A073, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48302
https://doi.org/10.1115/IPACK2015-48302
View Paper titled, On Simple Prediction Method for Thermal Contact Resistance Between Wavy Surfaces With Thermal Interface Material Under Low Mean Nominal Contact Pressure (Fundamental Study Based on 1-D Model)
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Topics: Contact resistance, Pressure, Heat, Surface roughness, Temperature, Bearings, Control systems, Electronic equipment, Errors, Satellites
Proceedings Papers

Flow Resistance Network Analysis in Fan-Cooled High-Density Packaging Electronic Equipment

Takashi Fukue, Tomoyuki Hatakeyama, Masaru Ishizuka, Koichi Hirose, Kazuma Obata, Katsuhiro Koizumi
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A044, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48600
https://doi.org/10.1115/IPACK2015-48600
View Paper titled, Flow Resistance Network Analysis in Fan-Cooled High-Density Packaging Electronic Equipment
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Topics: Density, Electronic equipment, Flow (Dynamics), Network analysis, Packaging, Air flow, Computational fluid dynamics, Cooling, Design, Diluents
Proceedings Papers

A Parametric Study of the Impact of Energy Relaxation Time on Thermal Behavior of Power Si MOSFET in Electro-Thermal Analysis

Risako Kibushi, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru Ishizuka
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A061, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48802
https://doi.org/10.1115/IPACK2015-48802
View Paper titled, A Parametric Study of the Impact of Energy Relaxation Time on Thermal Behavior of Power Si MOSFET in Electro-Thermal Analysis
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Topics: MOSFET transistors, Relaxation (Physics), Temperature distribution, Simulation, Electric fields, Thermal properties, Heat, Physics, Temperature
Proceedings Papers

Microprocessor Silicon Die Temperature Prediction by Simplified Boundary Conditions

Koji Nishi, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru Ishizuka
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A082, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48205
https://doi.org/10.1115/IPACK2015-48205
View Paper titled, Microprocessor Silicon Die Temperature Prediction by Simplified Boundary Conditions
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Topics: Boundary-value problems, Silicon, Temperature, Thermal resistance, Computation, Heat conduction, Heat transfer, Simulation results, Design, Electronic equipment
Proceedings Papers

Numerical Analysis of Two-Dimensional Compressible Viscous Flow in Turbomachinery Cascades Using an Improved k-ε Turbulence Model

Debasish Biswas, Hideo Iwasaki, Masaru Ishizuka
Proc. ASME. GT1997, Volume 1: Aircraft Engine; Marine; Turbomachinery; Microturbines and Small Turbomachinery, V001T03A070, June 2–5, 1997
Publisher: American Society of Mechanical Engineers
Paper No: 97-GT-417
https://doi.org/10.1115/97-GT-417
View Paper titled, Numerical Analysis of Two-Dimensional Compressible Viscous Flow in Turbomachinery Cascades Using an Improved k-ε Turbulence Model
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Topics: Numerical analysis, Turbomachinery, Turbulence, Viscous flow, Shock (Mechanics), Blades, Flow (Dynamics), Reynolds number, Boundary layers, Compressors
Proceedings Papers

Relationships Between Supply Flow Rate of Small Cooling Fans and Pressure Drop Characteristics in Electronic Enclosure

Takashi Fukue, Tomoyuki Hatakeyama, Masaru Ishizuka, Koichi Hirose, Katsuhiro Koizumi
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A020, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73089
https://doi.org/10.1115/IPACK2013-73089
View Paper titled, Relationships Between Supply Flow Rate of Small Cooling Fans and Pressure Drop Characteristics in Electronic Enclosure
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Topics: Cooling, Fans, Flow (Dynamics), Pressure drop, Density, Packaging, Pressure, Design, Electronic equipment
Proceedings Papers

Steady and Transient Heat Transfer Analysis of the Microprocessor System Using One-Dimensional Thermal Network

Koji Nishi, Tomoyuki Hatakeyama, Masaru Ishizuka
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A009, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73052
https://doi.org/10.1115/IPACK2013-73052
View Paper titled, Steady and Transient Heat Transfer Analysis of the Microprocessor System Using One-Dimensional Thermal Network
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Topics: Cooling, Heat, Heat conduction, Heat sinks, Silicon, Simulation, Steady state, Temperature, Thermal resistance, Transient heat transfer
Proceedings Papers

Estimation of Heat Generation From Power Si MOSFET Using Electro-Thermal Analysis

Risako Kibushi, Tomoyuki Hatakeyama, Masaru Ishizuka
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A049, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73273
https://doi.org/10.1115/IPACK2013-73273
View Paper titled, Estimation of Heat Generation From Power Si MOSFET Using Electro-Thermal Analysis
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Topics: Heat, MOSFET transistors, Electrons, Temperature, Thermal energy, Thermal properties, Crystal lattices, Density, Electric fields, Electronics
Proceedings Papers

Estimation of Heat Generation From Power Si MOSFET Using Electro-Thermal Analysis

Risako Kibushi, Tomoyuki Hatakeyama, Masaru Ishizuka
Proc. ASME. ICNMM2013, ASME 2013 11th International Conference on Nanochannels, Microchannels, and Minichannels, V001T05A005, June 16–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2013-73169
https://doi.org/10.1115/ICNMM2013-73169
View Paper titled, Estimation of Heat Generation From Power Si MOSFET Using Electro-Thermal Analysis
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Topics: Heat, MOSFET transistors, Electrical properties, Electrons, Thermal energy, Crystal lattices, Electric fields, Electronics, Energy levels (Quantum mechanics), Temperature
Proceedings Papers

Comparison Between PIV Results and CFD Simulations of Air Flows in a Thin Electronics Casing Model

Masaru Ishizuka, Tomoyuki Hatakeyama, Risako Kibushi, Yasushi Nishino, Shinji Nakagawa
Proc. ASME. IMECE2012, Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D, 1405-1410, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-85581
https://doi.org/10.1115/IMECE2012-85581
View Paper titled, Comparison Between PIV Results and CFD Simulations of Air Flows in a Thin Electronics Casing Model
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Topics: Air flow, Computational fluid dynamics, Electronics, Engineering simulation, Simulation, Electronic equipment, Flow (Dynamics), Cooling, Heat, Particulate matter
Proceedings Papers

Study on P-Q Curves of Cooling Fans for Thermal Design of Electronic Equipment (Effects of Opening Position of Obstructions Near a Fan)

Takashi Fukue, Masaru Ishizuka, Tomoyuki Hatakeyama, Shinji Nakagawa, Katsuhiro Koizumi
Proc. ASME. AJK2011, ASME-JSME-KSME 2011 Joint Fluids Engineering Conference: Volume 1, Symposia – Parts A, B, C, and D, 737-745, July 24–29, 2011
Publisher: American Society of Mechanical Engineers
Paper No: AJK2011-22054
https://doi.org/10.1115/AJK2011-22054
View Paper titled, Study on P-Q Curves of Cooling Fans for Thermal Design of Electronic Equipment (Effects of Opening Position of Obstructions Near a Fan)
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Topics: Cooling, Design, Electronic equipment, Fans, Flow (Dynamics), Pressure, Density, Capacitors, Electronic components, Heat sinks
Proceedings Papers

Optimization of Natural Air Cooling in a Vertical Channel of Electronic Equipment

Yasushi Nishino, Masaru Ishizuka, Tomoyuki Hatakeyama, Shinji Nakagawa
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 145-153, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-37028
https://doi.org/10.1115/IMECE2010-37028
View Paper titled, Optimization of Natural Air Cooling in a Vertical Channel of Electronic Equipment
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Topics: Cooling, Electronic equipment, Optimization, Clearances (Engineering), Copper, Computer simulation, Temperature, Air flow, Ducts, Natural convection
Proceedings Papers

Thermal Resistance Measurement and Thermal Network Analysis of Printed Circuit Board With Thermal Vias

Tomoyuki Hatakeyama, Masaru Ishizuka, Shinji Nakagawa, Sadakazu Takakuwa
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 251-258, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52168
https://doi.org/10.1115/IPACK2011-52168
View Paper titled, Thermal Resistance Measurement and Thermal Network Analysis of Printed Circuit Board With Thermal Vias
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Topics: Network analysis, Printed circuit boards, Thermal resistance, Copper, Heat, Computational fluid dynamics, Temperature, Electronics, Epoxy adhesives, Epoxy resins