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Pedro O. Quintero
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Proceedings Papers

Phase Change Material’s (PCMs) Effectiveness Index for Rapid Assessment in Thermal Management of Transient Pulse Electronics

Adrian Olivera, Jhonathan Rosales, Pedro O. Quintero
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-69321
https://doi.org/10.1115/IPACK2021-69321
View Paper titled, Phase Change Material’s (PCMs) Effectiveness Index for Rapid Assessment in Thermal Management of Transient Pulse Electronics
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Topics: Design, Electronics, Heat, Phase change materials, Thermal management, Transients (Dynamics)
Journal Articles

Metallic Phase Change Material's Microstructural Stability Under Repetitive Melting/Solidification Cycles

Rafael Báez, Luis E. González, Manny X. de Jesús-López, Pedro O. Quintero, Lauren M. Boteler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031110.
Paper No: EP-20-1013
https://doi.org/10.1115/1.4047063
Published Online: May 13, 2020
View Articletitled, Metallic Phase Change Material's Microstructural Stability Under Repetitive Melting/Solidification Cycles
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Topics: Cycles, Melting, Metals, Solidification, Temperature, Alloys, Stability
Proceedings Papers

Metallic PCM’s Microstructural Stability Under Repetitive Melting/Solidification Cycles

Rafael Báez, Luis E. González, Pedro O. Quintero, Lauren M. Boteler
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A005, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6385
https://doi.org/10.1115/IPACK2019-6385
View Paper titled, Metallic PCM’s Microstructural Stability Under Repetitive Melting/Solidification Cycles
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Topics: Cooling, Cycles, Melting, Solidification, Stability, Thermal stability, Alloys, Metals, Temperature, Thermal management
Proceedings Papers

Numerical Approach to Cold Gas Spray on Ceramic Substrates for Power Electronics Packaging

Marco J. Echeverría, Pedro O. Quintero, Dimeji Ibitayo, Lauren Boteler
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A007, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8279
https://doi.org/10.1115/IPACK2018-8279
View Paper titled, Numerical Approach to Cold Gas Spray on Ceramic Substrates for Power Electronics Packaging
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Topics: Ceramics, Electronic packaging, Sprays, Copper, Manufacturing, Reliability, Aluminum, Bonding, Brittleness, Computer simulation
Proceedings Papers

Multifunctional Chip for Use in Thermal Analysis of Power Systems

David Gonzalez-Nino, Lauren Boteler, Damian P. Urciuoli, Iain M. Kierzewski, Dimeji Ibitayo, Pedro O. Quintero
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A014, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8355
https://doi.org/10.1115/IPACK2018-8355
View Paper titled, Multifunctional Chip for Use in Thermal Analysis of Power Systems
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Topics: Design, Electronic systems, Flux (Metallurgy), Heat, Heat flux, High temperature, Instrumentation, Junctions, Military systems, Power systems (Machinery)
Proceedings Papers

Voiding Effects on the Thermal Response of Metallic Phase Change Materials Under Pulsed Power Loading

David Gonzalez-Nino, Lauren M. Boteler, Nicholas R. Jankowski, Dimeji Ibitayo, Pedro O. Quintero
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74118
https://doi.org/10.1115/IPACK2017-74118
View Paper titled, Voiding Effects on the Thermal Response of Metallic Phase Change Materials Under Pulsed Power Loading
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Topics: Phase change materials, Heat, Silicon nitride ceramics, Temperature, Cooling, Cooling systems, Cycles, Inspection, Optical quality control, Temperature profiles
Proceedings Papers

Numerical Evaluation of Multiple Phase Change Materials for Pulsed Electronics Applications

David Gonzalez-Nino, Lauren M. Boteler, Dimeji Ibitayo, Nicholas R. Jankowski, Pedro O. Quintero
Proc. ASME. HT2016, Volume 2: Heat Transfer in Multiphase Systems; Gas Turbine Heat Transfer; Manufacturing and Materials Processing; Heat Transfer in Electronic Equipment; Heat and Mass Transfer in Biotechnology; Heat Transfer Under Extreme Conditions; Computational Heat Transfer; Heat Transfer Visualization Gallery; General Papers on Heat Transfer; Multiphase Flow and Heat Transfer; Transport Phenomena in Manufacturing and Materials Processing, V002T11A004, July 10–14, 2016
Publisher: American Society of Mechanical Engineers
Paper No: HT2016-7223
https://doi.org/10.1115/HT2016-7223
View Paper titled, Numerical Evaluation of Multiple Phase Change Materials for Pulsed Electronics Applications
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Topics: Electronics, Phase change materials, Heat, Tin, Transients (Dynamics), Stress, Thermal conductivity, Absorption, Finite difference methods, Gallium
Proceedings Papers

Microstructural Stability of Au-Sn SLID Joints for Harsh Environments

Paola Rivera Soto, Pedro O. Quintero, Mellyssa Mulero, Dimeji Ibitayo
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A035, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48323
https://doi.org/10.1115/IPACK2015-48323
View Paper titled, Microstructural Stability of Au-Sn SLID Joints for Harsh Environments
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Topics: Stability, Tin, Bonding, Melting point, Fracture (Materials), Copper, Diffusion (Physics), Electronic packaging, Intermetallic compounds, Microscopy
Proceedings Papers

High Temperature Die Attach by Low Temperature Solid-Liquid Interdiffusion

Rogie I. Rodriguez, Dimeji Ibitayo, Pedro O. Quintero
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 9-17, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52049
https://doi.org/10.1115/IPACK2011-52049
View Paper titled, High Temperature Die Attach by Low Temperature Solid-Liquid Interdiffusion
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Topics: High temperature, Low temperature, Temperature, Tin, Diffusion (Physics), Melting point, Bonding, Electromechanical devices, Electronic packaging, Electronics
Proceedings Papers

Canaries Development via Combinatorial Materials Science Techniques for Prognostics and Health Management in Electronics Systems

Pedro O. Quintero Aguilo, Ricky Valentin, Pablo Caceres Valencia
Proc. ASME. SMASIS2010, ASME 2010 Conference on Smart Materials, Adaptive Structures and Intelligent Systems, Volume 2, 761-768, September 28–October 1, 2010
Publisher: American Society of Mechanical Engineers
Paper No: SMASIS2010-3860
https://doi.org/10.1115/SMASIS2010-3860
View Paper titled, Canaries Development via Combinatorial Materials Science Techniques for Prognostics and Health Management in Electronics Systems
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Topics: Electronics, Materials science, Cycles, Errors, Failure, Design, Fault tolerant computing, Hardware
Proceedings Papers

Combinatorial Studies for the Minimization of Tin Whiskers Growth in Lead Free Electronics

Pedro O. Quintero-Aguilo´, Pablo Ca´ceres-Valencia, Ricky Valenti´n, Alfredo Di´az
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 347-352, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89029
https://doi.org/10.1115/InterPACK2009-89029
View Paper titled, Combinatorial Studies for the Minimization of Tin Whiskers Growth in Lead Free Electronics
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Topics: Electronics, Glass, Compressive stress, Diffusion (Physics), Heat treating (Metalworking), Intermetallic compounds, Manufacturing, Materials science, Nickel, Scanning electron microscopy
Proceedings Papers

High Temperature Lead-Free Attach Reliability

Patrick McCluskey, Pedro O. Quintero
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 93-98, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33457
https://doi.org/10.1115/IPACK2007-33457
View Paper titled, High Temperature Lead-Free Attach Reliability
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Topics: High temperature, Reliability, Packaging, Temperature, Electronic products, Electronics, Failure, Manufacturing, Modeling, Physics