1-4 of 4
Rainer Dudek
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

Sven Rzepka, Alexander Otto, Dietmar Vogel, Rainer Dudek
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010903.
Paper No: EP-17-1090
https://doi.org/10.1115/1.4039333
Published Online: March 2, 2018
View Article titled, Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches
Open the PDF for Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches in another window
Topics: Electronics, Failure, Reliability, Stress, Temperature, Failure mechanisms, Cycles, Safety, Failure analysis, Simulation
Proceedings Papers

Application Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

Sven Rzepka, Alexander Otto, Dietmar Vogel, Rainer Dudek
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A008, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74208
https://doi.org/10.1115/IPACK2017-74208
View Paper titled, Application Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches
Open the PDF for Application Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches in another window
Topics: Electronics, Reliability, Safety, Automotive industry, Failure, Vehicles, Actuators, Computation, Design, Electric vehicles
Proceedings Papers

An Integrated Experimental and Theoretical Approach to Evaluate Si Strength Dependent on the Processing History

John Brueckner, Rainer Dudek, Sven Rzepka, Bernd Michel
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 139-145, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89270
https://doi.org/10.1115/InterPACK2009-89270
View Paper titled, An Integrated Experimental and Theoretical Approach to Evaluate Si Strength Dependent on the Processing History
Open the PDF for An Integrated Experimental and Theoretical Approach to Evaluate Si Strength Dependent on the Processing History in another window
Topics: Anisotropy, Brittleness, Ceramics, Damage, Experimental characterization, Failure, Finite element analysis, Fracture (Process), Grinding, Grinding wheels
Journal Articles

Reliability Prediction of Area Array Solder Joints

Rainer Dudek, Ralf Do¨ring, Bernd Michel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 562–568.
https://doi.org/10.1115/1.1604802
Published Online: December 15, 2003
View Article titled, Reliability Prediction of Area Array Solder Joints
Open the PDF for Reliability Prediction of Area Array Solder Joints in another window
Topics: Ball-Grid-Array packaging, Creep, Fatigue, Modeling, Reliability, Solder joints, Solders, Temperature, Cycles, Geometric modeling