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Richard C. Chu
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eBook Chapter

Introduction

Publisher: ASME Press
Published: 2013
ISBN: 9780791860205
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Topics: Circuits, Computer software, Computers, Electronics, Internet, Microwaves, Optical fiber, Satellites, Telecommunications
eBook Chapter

Component and Printed Circuit Board

Publisher: ASME Press
Published: 2013
ISBN: 9780791860205
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Topics: Printed circuit boards, Integrated circuits, Silicon, Heat, Inventions, Manufacturing, Transistors
eBook Chapter

Fans and Air Handling Systems

Publisher: ASME Press
Published: 2013
ISBN: 9780791860205
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Topics: Fans, Cooling, Air flow, Cooling systems, Electronic equipment, Electronic systems, Electronics, Engines, Motors, Particulate matter
eBook Chapter

Air Cooling and Heat Sinks

Publisher: ASME Press
Published: 2013
ISBN: 9780791860205
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Topics: Cooling, Heat sinks
eBook Chapter

System Thermal Analysis—Rack/Cabinet (Part I)

Publisher: ASME Press
Published: 2013
ISBN: 9780791860205
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Topics: Thermal analysis, Telecommunications
eBook Chapter

System Thermal Analysis—Rack/Cabinet (Part II)

Publisher: ASME Press
Published: 2013
ISBN: 9780791860205
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Topics: Thermal analysis
eBook Chapter

System Thermal Analysis—Small Box

Publisher: ASME Press
Published: 2013
ISBN: 9780791860205
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Topics: Thermal analysis, Cooling, Fans, Natural convection, Printed circuit boards, Telecommunications
eBook Chapter

Outdoor Electronic Equipment

Publisher: ASME Press
Published: 2013
ISBN: 9780791860205
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Topics: Electronic equipment
eBook Chapter

Liquid Cooled Systems

Publisher: ASME Press
Published: 2013
ISBN: 9780791860205
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Topics: Boiling, Condensation, Cooling, Electronic equipment, Heat transfer, Latent heat, Temperature, Two-phase flow
eBook Chapter

Thermal Management and Energy Efficiency

Publisher: ASME Press
Published: 2013
ISBN: 9780791860205
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Topics: Energy efficiency, Thermal management, Telecommunications, Design, Traffic, Power density
eBook
Book Cover Image

Thermal Management of Telecommunications Equipment

Publisher: ASME Press
Published: 2013
ISBN: 9780791860205
Proceedings Papers

Maintaining Datacom Rack Inlet Air Temperatures With Water Cooled Heat Exchanger

Roger Schmidt, Richard C. Chu, Mike Ellsworth, Madhu Iyengar, Don Porter, Vinod Kamath, Bret Lehman
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 663-673, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73468
https://doi.org/10.1115/IPACK2005-73468
View Paper titled, Maintaining Datacom Rack Inlet Air Temperatures With Water Cooled Heat Exchanger
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Topics: Data centers, Doors, Heat exchangers, Temperature, Water
Proceedings Papers

The Challenges of Electronic Cooling: Past, Current and Future

Richard C. Chu
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 619-630, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42198
https://doi.org/10.1115/IMECE2003-42198
View Paper titled, The Challenges of Electronic Cooling: Past, Current and Future
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Topics: Computer cooling, Conceptual design, Cooling
Journal Articles

The Challenges of Electronic Cooling: Past, Current and Future

Richard C. Chu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 491–500.
https://doi.org/10.1115/1.1839594
Published Online: January 24, 2005
View Article titled, The Challenges of Electronic Cooling: Past, Current and Future
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Topics: Cooling