Search Results | ASME Digital Collection

Proc. ASME. OMAE2012, Volume 4: Offshore Geotechnics; Ronald W. Yeung Honoring Symposium on Offshore and Ship Hydrodynamics, 669-674, July 1–6, 2012

Paper No: OMAE2012-83666

DOI: https://doi.org/10.1115/OMAE2012-83666

View Paper

Topics: Buoys, Ducts, Numerical analysis, Damping, Elevations (Drawings), Simulation, Waves, Boundary element methods, Boundary-value problems, Corners (Structural elements)

Journal Articles

Discussion: “Heat Transfer Measurement and Analysis for Sintered Porous Channels” (Hwang, G. J., and Chao, C. H., 1994, ASME J. Heat Transfer, 116 , pp. 456–464)

S. J. Kim and, D. Kim

J. Heat Transfer. August 2000, 122(3): 632–633.

DOI: https://doi.org/10.1115/1.1289648

Published Online: August 1, 2000

View Article

Topics: Heat transfer, Temperature distribution, Thermal conductivity, Channel flow, Flow (Dynamics), Porous materials, Sintering

Journal Articles

Forced Convection in Microstructures for Electronic Equipment Cooling

S. J. Kim, D. Kim

J. Heat Transfer. August 1999, 121(3): 639–645.

DOI: https://doi.org/10.1115/1.2826027

Published Online: August 1, 1999

View Article

Topics: Cooling, Electronic equipment, Forced convection, Heat transfer, Porous materials, Heat sinks, Fluids, Microchannels, Fluid dynamics, Temperature

Journal Articles

Closure to “Discussion of a Discussion by K. Vafai and S. J. Kim” (1997, ASME J. Heat Transfer, 119, pp. 195–196)

K. Vafai, S. J. Kim

J. Heat Transfer. February 1997, 119(1): 196–197.

DOI: https://doi.org/10.1115/1.2824093

Published Online: February 1, 1997

View Article

Topics: Heat transfer

Journal Articles

Closure to “Discussion of a Discussion by F. Chen and C. F. Chen” (1997, ASME J. Heat Transfer, 119, pp. 193–194)

K. Vafai, S. J. Kim

J. Heat Transfer. February 1997, 119(1): 194–195.

DOI: https://doi.org/10.1115/1.2824091

Published Online: February 1, 1997

View Article

Topics: Heat transfer

Journal Articles

Erratum: “Closure to Discussion of ‘Analysis of Heat Transfer Regulation and Modification Employing Intermittently Emplaced Porous Cavities’ and ‘Analysis of Flow and Heat Transfer Over an External Boundary Covered With Porous Substrate’” (Journal of Heat Transfer, 1996, 118, pp. 267–268)

K. Vafai, S. J. Kim

J. Heat Transfer. February 1997, 119(1): 197.

DOI: https://doi.org/10.1115/1.2824094

Published Online: February 1, 1997

View Article

Topics: Cavities, Flow (Dynamics), Heat transfer

Journal Articles

Discussion: “Forced Convection in a Porous Channel With Localized Heat Sources” (Hadim, A., 1994, ASME J. Heat Transfer, 116, pp. 465–472)

K. Vafai, S. J. Kim

J. Heat Transfer. November 1995, 117(4): 1097–1098.

DOI: https://doi.org/10.1115/1.2836294

Published Online: November 1, 1995

View Article

Topics: Forced convection, Heat, Heat transfer

Journal Articles

Closure to “Discussion of ‘Analysis of Heat Transfer Regulation and Modification Employing Intermittently Emplaced Porous Cavities’ and ‘Analysis of Flow and Heat Transfer Over an External Boundary Covered With a Porous Substrate’” (1995, ASME J. Heat Transfer, 117, p. 554)

K. Vafai, S. J. Kim

J. Heat Transfer. May 1995, 117(2): 554–555.

DOI: https://doi.org/10.1115/1.2822568

Published Online: May 1, 1995

View Article

Topics: Cavities, Flow (Dynamics), Heat transfer

Journal Articles

Effects of Substrate Conductivity on Convective Cooling of Electronic Components

C. Y. Choi, S. J. Kim, A. Ortega

J. Electron. Packag. September 1994, 116(3): 198–205.

DOI: https://doi.org/10.1115/1.2905686

Published Online: September 1, 1994

View Article

Topics: Cooling, Electrical conductivity, Electronic components, Thermal conductivity, Heat conduction, Fluids, Heat, Temperature, Boundary-value problems, Convection

Journal Articles

Non-Darcian Effects in Open-Ended Cavities Filled With a Porous Medium

J. Ettefagh, K. Vafai, S. J. Kim

J. Heat Transfer. August 1991, 113(3): 747–756.

DOI: https://doi.org/10.1115/1.2910627

Published Online: August 1, 1991

View Article

Topics: Cavities, Heat transfer, Porous materials

Journal Articles

Forced Convection in a Channel Filled With a Porous Medium: An Exact Solution

K. Vafai, S. J. Kim

J. Heat Transfer. November 1989, 111(4): 1103–1106.

DOI: https://doi.org/10.1115/1.3250779

Published Online: November 1, 1989

View Article

Topics: Forced convection, Porous materials, Heat transfer

Journal citation

NARROW

Supplemental Material

Hydrostatic Stability and Global Performance Analysis for Set TLP

Observations of the Critical Heat Flux Process During Pool Boiling of FC-72

Numerical Analysis of Hydrodynamic Performance of Backward Bent Duct Buoy (BBDB)

Discussion: “Heat Transfer Measurement and Analysis for Sintered Porous Channels” (Hwang, G. J., and Chao, C. H., 1994, ASME J. Heat Transfer, 116 , pp. 456–464)

Forced Convection in Microstructures for Electronic Equipment Cooling

Closure to “Discussion of a Discussion by K. Vafai and S. J. Kim” (1997, ASME J. Heat Transfer, 119, pp. 195–196)

Closure to “Discussion of a Discussion by F. Chen and C. F. Chen” (1997, ASME J. Heat Transfer, 119, pp. 193–194)

Discussion: “Forced Convection in a Porous Channel With Localized Heat Sources” (Hadim, A., 1994, ASME J. Heat Transfer, 116, pp. 465–472)

Closure to “Discussion of ‘Analysis of Heat Transfer Regulation and Modification Employing Intermittently Emplaced Porous Cavities’ and ‘Analysis of Flow and Heat Transfer Over an External Boundary Covered With a Porous Substrate’” (1995, ASME J. Heat Transfer, 117, p. 554)

Effects of Substrate Conductivity on Convective Cooling of Electronic Components

Non-Darcian Effects in Open-Ended Cavities Filled With a Porous Medium

Forced Convection in a Channel Filled With a Porous Medium: An Exact Solution

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only