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Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A046, July 6–9, 2015

Paper No: IPACK2015-48664

DOI: https://doi.org/10.1115/IPACK2015-48664

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Topics: Absorption, Emissions, Light scattering, Light-emitting diodes, Modeling, Phosphors, Wavelength, Excitation, Emission spectra, Plates (structures)

Journal Articles

Comparison of Ball Pull Strength Among Various Sn-Cu-Ni Solder Joints With Different Pad Surface Finishes

Chaoran Yang, Fubin Song, S. W. Ricky Lee

J. Electron. Packag. March 2014, 136(1): 011003.

Paper No: EP-12-1017

DOI: https://doi.org/10.1115/1.4025915

Published Online: November 28, 2013

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Topics: Finishes, Solder joints, Solders, Tin, Temperature, Inspection

Proceedings Papers

Fast Copper Plating Process for Through Silicon Via (TSV) Filling

Su Wang, S. W. Ricky Lee

Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 855-863, November 11–17, 2011

Paper No: IMECE2011-64782

DOI: https://doi.org/10.1115/IMECE2011-64782

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Topics: Copper, Electroplating, Plating, Silicon

Proceedings Papers

Embedded 3D Hybrid IC Integration System-in-Package (SiP) for Opto-Electronic Interconnects in Organic Substrates

John H. Lau, M. S. Zhang, S. W. Ricky Lee

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 129-136, November 12–18, 2010

Paper No: IMECE2010-40974

DOI: https://doi.org/10.1115/IMECE2010-40974

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Topics: Cavities, Circuits, Continuum mechanics, Engineering simulation, Flat heat pipes, Heat, Heat transfer, Lasers, Optical instruments, Optical interconnections

Proceedings Papers

Thermal-Enhanced and Cost-Effective 3D IC Integration With TSV (Through-Silicon Via) Interposers for High-Performance Applications

John H. Lau, Y. S. Chan, S. W. Ricky Lee

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 137-144, November 12–18, 2010

Paper No: IMECE2010-40975

DOI: https://doi.org/10.1115/IMECE2010-40975

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Topics: Silicon, Flat heat pipes, Heat sinks, Creep, Engineering simulation, Flip-chip devices, Heat transfer, Reliability, Simulation, Structural design

Proceedings Papers

Comparison of Fatigue Crack Initiation/Propagation and Daisy-Chain Resistance in Lead-Free Solder Joints Under Temperature Cycling Test

Y. Sing Chan, F. B. Song, S. W. Ricky Lee, C. R. Yang, Jeffery C. C. Lo

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 579-583, July 6–8, 2011

Paper No: IPACK2011-52219

DOI: https://doi.org/10.1115/IPACK2011-52219

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Topics: Chain, Fatigue cracks, Lead-free solders, Temperature, Solder joints, Electrical resistance, Failure, Fatigue, Fatigue failure, Fracture (Materials)

Journal Articles

Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards

John H. Lau, M. S. Zhang, S. W. Ricky Lee

J. Electron. Packag. September 2011, 133(3): 031010.

DOI: https://doi.org/10.1115/1.4004861

Published Online: September 26, 2011

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Topics: Design, Polymers, System-in-package, Waveguides, Simulation, Printed circuit boards, Optical interconnections, Integrated circuits, Engineering simulation, Heat

Proceedings Papers

Assessment of Relative Thermal Fatigue Life of SAC Lead-Free and Tin-Lead Solders With Custom-Made BGA Assemblies Creating Various Stress Ranges

Y. S. Chan, C. Yang, S. W. Ricky Lee

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 803-807, July 19–23, 2009

Paper No: InterPACK2009-89260

DOI: https://doi.org/10.1115/InterPACK2009-89260

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Topics: Ball-Grid-Array packaging, Fatigue life, Solders, Stress, Solder joints, Copper, Creep, Cycles, Manufacturing, Relaxation (Physics)

Proceedings Papers

Effects of Tooling Tip Wear and Fixture Rigidity on Solder Ball Shear and Ball Pull Tests

Fubin Song, S. W. Ricky Lee

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 889-894, July 8–12, 2007

Paper No: IPACK2007-33933

DOI: https://doi.org/10.1115/IPACK2007-33933

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Topics: Shear (Mechanics), Solders, Stiffness, Tooling, Wear, Failure mechanisms, Fracture (Materials), Gluing, Brittleness, Electromagnetic scattering

Proceedings Papers

Screen-Printing of Yellow Phosphor Powder on Blue Light Emitting Diode (LED) Arrays for White Light Illumination

K. H. Lee, S. W. Ricky Lee

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 19-24, July 8–12, 2007

Paper No: IPACK2007-33971

DOI: https://doi.org/10.1115/IPACK2007-33971

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Topics: Light-emitting diodes, Phosphors, Printing, Coating processes, Coatings, Circuit design, Density, Manufacturing, Packing (Shipments), Packings (Cushioning)

Proceedings Papers

Investigation of Moisture Sensitivity Related Failure Mechanism of Quad Flat No-Lead (QFN) Packages

Minshu Zhang, S. W. Ricky Lee

Proc. ASME. IMECE2008, Volume 6: Electronics and Photonics, 213-218, October 31–November 6, 2008

Paper No: IMECE2008-68120

DOI: https://doi.org/10.1115/IMECE2008-68120

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Topics: Failure mechanisms, Adhesion, Engineering simulation, Failure, Materials properties, Simulation, Ambiguity, Delamination, Finite element analysis, Finite element model

Proceedings Papers

Stress Analysis of Hygrothermal Delamination of Quad Flat No-Lead (QFN) Packages

Minshu Zhang, S. W. Ricky Lee, Xuejun Fan

Proc. ASME. IMECE2008, Volume 12: Mechanics of Solids, Structures and Fluids, 339-347, October 31–November 6, 2008

Paper No: IMECE2008-68110

DOI: https://doi.org/10.1115/IMECE2008-68110

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Topics: Delamination, Stress analysis (Engineering), Simulation, Stress, Finite element analysis, Finite element model, Reliability, Complex systems, Failure, Failure mechanisms

Proceedings Papers

Fabrication of Nanoscale Vias by Offset Patterning

Chi Ho Lau, S. W. Ricky Lee

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 615-618, June 3–5, 2008

Paper No: MicroNano2008-70131

DOI: https://doi.org/10.1115/MicroNano2008-70131

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Topics: Manufacturing, Nanoscale phenomena, Photolithography, Size reduction (Materials)

Proceedings Papers

Design and Fabrication of MEMS Based Microphone Module by Using 3D Chip-on-Chip Package

Jeffery C. C. Lo, S. W. Ricky Lee

Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 47-54, November 11–15, 2007

Paper No: IMECE2007-42561

DOI: https://doi.org/10.1115/IMECE2007-42561

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Topics: Design, Manufacturing, Microelectromechanical systems, Microphones, Packaging, Flip-chip, Flip-chip devices, Flow (Dynamics), Wire, Diaphragms (Mechanical devices)

Proceedings Papers

Thermal-Fatigue Life Prediction Equation for Plastic Ball Grid Array (PBGA) SnAgCu Lead-Free Solder Joints

John Lau, S. W. Ricky Lee, Fubin Song, Dongkai Shangguan, Dennis C. Lau, Walter Dauksher

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1013-1019, July 17–22, 2005

Paper No: IPACK2005-73362

DOI: https://doi.org/10.1115/IPACK2005-73362

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Topics: Ball-Grid-Array packaging, Fatigue, Lead-free solders, Alloys, Failure mechanisms, Vehicles

Journal citation

NARROW

Prediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level Testing

Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications

Fabrication and Reliability Assessment of Cu Pillar Microbumps With Printed Polymer Cores

Assessment of Fatigue Induced Pad Cratering With a Universal Expression of Printed Circuit Board Fatigue Resistance

Correlation of Warpage Distribution With the Material Property Scattering for Warpage Range Prediction of PBGA Components

Modeling and Parametric Study of Light Scattering, Absorption and Emission of Phosphor in a White Light-Emitting Diode

Comparison of Ball Pull Strength Among Various Sn-Cu-Ni Solder Joints With Different Pad Surface Finishes

Fast Copper Plating Process for Through Silicon Via (TSV) Filling

Embedded 3D Hybrid IC Integration System-in-Package (SiP) for Opto-Electronic Interconnects in Organic Substrates

Thermal-Enhanced and Cost-Effective 3D IC Integration With TSV (Through-Silicon Via) Interposers for High-Performance Applications

Comparison of Fatigue Crack Initiation/Propagation and Daisy-Chain Resistance in Lead-Free Solder Joints Under Temperature Cycling Test

Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards

Assessment of Relative Thermal Fatigue Life of SAC Lead-Free and Tin-Lead Solders With Custom-Made BGA Assemblies Creating Various Stress Ranges

Effects of Tooling Tip Wear and Fixture Rigidity on Solder Ball Shear and Ball Pull Tests

Screen-Printing of Yellow Phosphor Powder on Blue Light Emitting Diode (LED) Arrays for White Light Illumination

Investigation of Moisture Sensitivity Related Failure Mechanism of Quad Flat No-Lead (QFN) Packages

Stress Analysis of Hygrothermal Delamination of Quad Flat No-Lead (QFN) Packages

Fabrication of Nanoscale Vias by Offset Patterning

Design and Fabrication of MEMS Based Microphone Module by Using 3D Chip-on-Chip Package

Thermal-Fatigue Life Prediction Equation for Plastic Ball Grid Array (PBGA) SnAgCu Lead-Free Solder Joints

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