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Proceedings Papers

Development of Low Emission Gas Turbine Combustors

Seung-chai Jung, Siwon Yang, Shaun Kim, Ik Soo Kim, Chul-ju Ahn, Ju Hyeong Cho, Jisu Yoon, Youngbin Yoon, Samson Yoon, Shiyang Ryu
Proc. ASME. GT2015, Volume 4A: Combustion, Fuels and Emissions, V04AT04A001, June 15–19, 2015
Publisher: American Society of Mechanical Engineers
Paper No: GT2015-42002
https://doi.org/10.1115/GT2015-42002
View Paper titled, Development of Low Emission Gas Turbine Combustors
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Topics: Combustion chambers, Emissions, Gas turbines, Flames, Design, Combustion, Computational fluid dynamics, Nitrogen oxides, Flow (Dynamics), Fuels
Proceedings Papers

Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem

Changsoo Jang, Bongtae Han, Seungbae Park, Samson Yoon
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 749-755, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33142
https://doi.org/10.1115/IPACK2007-33142
View Paper titled, Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem
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Topics: Diffusion (Physics), Microelectronic devices, Temperature
Journal Articles

Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading

Samson Yoon, Changsoo Jang, Bongtae Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2008, 130(2): 024502.
https://doi.org/10.1115/1.2912181
Published Online: May 14, 2008
View Article titled, Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading
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Topics: Diffusion (Physics), Finite element analysis, Heat transfer, Modeling, Semiconductors (Materials), Stress, Stress analysis (Engineering), Temperature, Deformation, Thermal expansion
Journal Articles

Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem

Changsoo Jang, Seungbae Park, Bongtae Han, Samson Yoon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011004.
https://doi.org/10.1115/1.2837521
Published Online: January 31, 2008
View Article titled, Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem
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Topics: Diffusion (Physics), Temperature, Transients (Dynamics), Finite difference methods
Journal Articles

On Moisture Diffusion Modeling Using Thermal-Moisture Analogy

Samson Yoon, Bongtae Han, Zhaoyang Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 421–426.
https://doi.org/10.1115/1.2804090
Published Online: April 24, 2007
View Article titled, On Moisture Diffusion Modeling Using Thermal-Moisture Analogy
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Topics: Diffusion (Physics)