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Samuel I-En Lin
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Proceedings Papers

A Study of Bifurcation Design Used in CD-ELISA Micro-Fluidic Platform

Samuel I. En Lin
Proc. ASME. NEMB2010, ASME 2010 First Global Congress on NanoEngineering for Medicine and Biology, 15-16, February 7–10, 2010
Publisher: American Society of Mechanical Engineers
Paper No: NEMB2010-13079
https://doi.org/10.1115/NEMB2010-13079
View Paper titled, A Study of Bifurcation Design Used in CD-ELISA Micro-Fluidic Platform
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Topics: Assaying, Bifurcation, Coriolis force, Design, Enzymes, Failure mechanisms, Flow (Dynamics), Food safety, Microchannels, Microfluidics
Journal Articles

Novel Bifurcation Design for Centrifugal Microfluidic Platform With Wide Range Rotational Speed

Samuel I-En Lin
Journal: Journal of Nanotechnology in Engineering and Medicine
Publisher: ASME
Article Type: Research Papers
J. Nanotechnol. Eng. Med. February 2011, 2(1): 011001.
https://doi.org/10.1115/1.4002748
Published Online: December 13, 2010
View Article titled, Novel Bifurcation Design for Centrifugal Microfluidic Platform With Wide Range Rotational Speed
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Topics: Bifurcation, Design, Microfluidics, Flow (Dynamics), Two-phase flow
Journal Articles

The Experimental Study on Improved Polishing Method for Terminating Optical Connector

Samuel I-En Lin
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Technical Briefs
J. Manuf. Sci. Eng. June 2008, 130(3): 034504.
https://doi.org/10.1115/1.2927438
Published Online: June 3, 2008
View Article titled, The Experimental Study on Improved Polishing Method for Terminating Optical Connector
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Topics: Polishing, Grinding, Fibers
Journal Articles

The Alignment Shift Formation Mechanism of Thin Film Based DWDM Module With Solder Assembly Packaging

Samuel I-En Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 273–281.
https://doi.org/10.1115/1.1756592
Published Online: October 6, 2004
View Article titled, The Alignment Shift Formation Mechanism of Thin Film Based DWDM Module With Solder Assembly Packaging
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Topics: Solders, Metals, Manufacturing, Thin films, Deformation
Journal Articles

Tunable Athermal Multi-FBG Package Using a Bending Bimetal Structure

Samuel I-En Lin, Mem. ASME,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2002, 124(1): 54–59.
https://doi.org/10.1115/1.1414135
Published Online: July 7, 2000
View Article titled, Tunable Athermal Multi-FBG Package Using a Bending Bimetal Structure
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Topics: Diffraction gratings, Fiber Bragg gratings, Fibers, Packaging, Temperature, Wavelength, Optical fiber, Deformation