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Proceedings Papers

The Application of Deep Learning and Computer Vision Techniques to Magnetic Flux Leakage Data to Accurately Detect and Predict Corrosion Profiles

Dustin Mattio, Scott Miller, James Rodway
Proc. ASME. IPC2024, Volume 2B: Pipeline and Facilities Integrity, V02BT03A011, September 23–27, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPC2024-133886
https://doi.org/10.1115/IPC2024-133886
View Paper titled, The Application of Deep Learning and Computer Vision Techniques to Magnetic Flux Leakage Data to Accurately Detect and Predict Corrosion Profiles
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Topics: Computer vision, Corrosion, Deep learning, Leakage, Magnetic flux, Pipelines, Shapes, Algorithms, Architecture, Artificial neural networks
Proceedings Papers

Comparative Performance Analysis of Screen-Printed Structures on PET and BPET Substrates Utilizing Low-Temperature ECA and MACA for SMD Component Attachment

Pradeep Lall, Shriram Kulkarni, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A010, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141881
https://doi.org/10.1115/IPACK2024-141881
View Paper titled, Comparative Performance Analysis of Screen-Printed Structures on PET and BPET Substrates Utilizing Low-Temperature ECA and MACA for SMD Component Attachment
Open the PDF for Comparative Performance Analysis of Screen-Printed Structures on PET and BPET Substrates Utilizing Low-Temperature ECA and MACA for SMD Component Attachment in another window
Topics: Biodegradation, Cellulose, Circuits, Electronics, Errors, Low temperature, Manufacturing, Printing, Sanitary landfills, Stability
Proceedings Papers

Additively Printed Circuits Using Biodegradable Substrates on Aerosol-Jet With Aqueous-Based Silver Conductive Paste Using ECA and Low-Temperature Interconnects

Pradeep Lall, Daniel Karakitie, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A009, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141879
https://doi.org/10.1115/IPACK2024-141879
View Paper titled, Additively Printed Circuits Using Biodegradable Substrates on Aerosol-Jet With Aqueous-Based Silver Conductive Paste Using ECA and Low-Temperature Interconnects
Open the PDF for Additively Printed Circuits Using Biodegradable Substrates on Aerosol-Jet With Aqueous-Based Silver Conductive Paste Using ECA and Low-Temperature Interconnects in another window
Topics: Aerosols, Biodegradation, Circuits, Inks, Low temperature, Silver, Water
Proceedings Papers

Evaluation of Additively Printed Filters on High-Temperature Performance on the Aerojet Platform Using Ceramics Substrate and Laser Ablation Process

Pradeep Lall, Daniel Karakitie, Ved Soni, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A012, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-142110
https://doi.org/10.1115/IPACK2024-142110
View Paper titled, Evaluation of Additively Printed Filters on High-Temperature Performance on the Aerojet Platform Using Ceramics Substrate and Laser Ablation Process
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Topics: Additive manufacturing, Aerosols, Ceramics, Circuits, Filters, High temperature, Inks, Laser ablation
Proceedings Papers

Performance and Reliability Comparison of Thermoformed, Screen-Printed Structures on Polycarbonate (PC) and High Impact Polystyrene (HIPS) Substrates Under Sustained High Temperatures for In-Mold Electronics

Pradeep Lall, Shriram Kulkarni, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A011, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141889
https://doi.org/10.1115/IPACK2024-141889
View Paper titled, Performance and Reliability Comparison of Thermoformed, Screen-Printed Structures on Polycarbonate (PC) and High Impact Polystyrene (HIPS) Substrates Under Sustained High Temperatures for In-Mold Electronics
Open the PDF for Performance and Reliability Comparison of Thermoformed, Screen-Printed Structures on Polycarbonate (PC) and High Impact Polystyrene (HIPS) Substrates Under Sustained High Temperatures for In-Mold Electronics in another window
Topics: Electronics, High temperature, Printing, Reliability
Proceedings Papers

Thermal Cycling Reliability on Encapsulated Flexible Printed Circuit Fabricated With Water-Based Ink and Room-Temperature Curable Adhesive

Pradeep Lall, Sabina Bimali, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A004, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141858
https://doi.org/10.1115/IPACK2024-141858
View Paper titled, Thermal Cycling Reliability on Encapsulated Flexible Printed Circuit Fabricated With Water-Based Ink and Room-Temperature Curable Adhesive
Open the PDF for Thermal Cycling Reliability on Encapsulated Flexible Printed Circuit Fabricated With Water-Based Ink and Room-Temperature Curable Adhesive in another window
Topics: Adhesives, Aerosols, Circuits, Printing, Reliability, Sustainability, Temperature, Water based printing inks
Proceedings Papers

Water-Based Inks and Low-Temperature Interconnects for Direct-Write Fabrication of Flexible Electronics Under Thermal Cycling

Pradeep Lall, Fatahi Musa, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A006, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141871
https://doi.org/10.1115/IPACK2024-141871
View Paper titled, Water-Based Inks and Low-Temperature Interconnects for Direct-Write Fabrication of Flexible Electronics Under Thermal Cycling
Open the PDF for Water-Based Inks and Low-Temperature Interconnects for Direct-Write Fabrication of Flexible Electronics Under Thermal Cycling in another window
Topics: Electronics, Flexible electronics, Low temperature, Manufacturing, Water based printing inks, Bonding, Electrical conductivity, Inks, Accelerated life testing, Additive manufacturing
Proceedings Papers

Performance and Reliability of In-Mold Direct-Write Signal Processing Circuits in Sustained High-Temperature Operation

Pradeep Lall, Md Golam Sarwar, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A005, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141863
https://doi.org/10.1115/IPACK2024-141863
View Paper titled, Performance and Reliability of In-Mold Direct-Write Signal Processing Circuits in Sustained High-Temperature Operation
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Topics: Adhesives, Circuits, High temperature, Printing, Reliability, Signal processing
Proceedings Papers

Process-Performance Interactions Under Exposure to Sustained High Temperature for Additively Manufactured Electronics and SMT Assembly With Low-Temperature Curable Adhesives

Pradeep Lall, Sabina Bimali, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A027, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141856
https://doi.org/10.1115/IPACK2024-141856
View Paper titled, Process-Performance Interactions Under Exposure to Sustained High Temperature for Additively Manufactured Electronics and SMT Assembly With Low-Temperature Curable Adhesives
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Topics: Additive manufacturing, Adhesives, Aerosols, Electronics, High temperature, Low temperature, Manufacturing, Printing
Proceedings Papers

Oscillator Performance on Thermoformed Additive In-Mold Electronics for Automotive Applications

Pradeep Lall, Aditya Harsha, Shriram Kulkarni, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A008, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141877
https://doi.org/10.1115/IPACK2024-141877
View Paper titled, Oscillator Performance on Thermoformed Additive In-Mold Electronics for Automotive Applications
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Topics: Automotive industry, Electronics, Printing
Proceedings Papers

Thermal Cycling Reliability of In-Mold Direct Write Additively Printed Integrator and Active Low-Pass Filter

Pradeep Lall, Fatahi Musa, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A007, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141874
https://doi.org/10.1115/IPACK2024-141874
View Paper titled, Thermal Cycling Reliability of In-Mold Direct Write Additively Printed Integrator and Active Low-Pass Filter
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Topics: Filters, Low-pass filters, Reliability, Automobiles, Durability, Electronics, Adhesives, Computer software, Cutting, Engineering simulation
Proceedings Papers

Evaluation of Printed Logic Circuits With Additively Packaged GaN Bare Die Devices at High Temperatures

Pradeep Lall, Ved Soni, Daniel Karakitie, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A014, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-142113
https://doi.org/10.1115/IPACK2024-142113
View Paper titled, Evaluation of Printed Logic Circuits With Additively Packaged GaN Bare Die Devices at High Temperatures
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Topics: Circuits, Electronics, Gallium nitride, High temperature, Lasers
Proceedings Papers

Reliability of Direct Write Additively Printed Sustainable Flexible Circuitry With ECA Under Sustained High-Temperature Operation

Pradeep Lall, Md Golam Sarwar, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A013, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-142111
https://doi.org/10.1115/IPACK2024-142111
View Paper titled, Reliability of Direct Write Additively Printed Sustainable Flexible Circuitry With ECA Under Sustained High-Temperature Operation
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Topics: High temperature, Printing, Reliability, Sustainability
Journal Articles

Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink

Pradeep Lall, Sabina Bimali, Scott Miller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041116.
Paper No: EP-24-1029
https://doi.org/10.1115/1.4066041
Published Online: August 17, 2024
View Articletitled, Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink
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Topics: Circuits, Design, Inks, Printing, Shear (Mechanics), Silver, Sintering, Aerosols, Stress, Water
Proceedings Papers

Repairability of SMDs on 3D Printed Circuitry for Sustainable Electronics Utilizing Direct Write Technique

Pradeep Lall, Md Golam Sarwar, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A015, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112061
https://doi.org/10.1115/IPACK2023-112061
View Paper titled, Repairability of SMDs on 3D Printed Circuitry for Sustainable Electronics Utilizing Direct Write Technique
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Topics: Additive manufacturing, Adhesives, Electronics, Flexible electronics, Printing, Surface mount devices, Sustainability
Proceedings Papers

Evaluation of Thermoformability of Additively Printed Circuits Printed Using Gravure Offset Printing Technique and Investigation of In-Mold Electronic Circuits

Pradeep Lall, Ved Soni, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A014, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112060
https://doi.org/10.1115/IPACK2023-112060
View Paper titled, Evaluation of Thermoformability of Additively Printed Circuits Printed Using Gravure Offset Printing Technique and Investigation of In-Mold Electronic Circuits
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Topics: Circuits, Electronic circuits, Electronics, Offset printing
Proceedings Papers

Investigation of Performance and Repairability of Additively Printed Functional Circuits With Water-Based Silver Ink on an Inkjet Platform

Pradeep Lall, Shriram Kulkarni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A020, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-114686
https://doi.org/10.1115/IPACK2023-114686
View Paper titled, Investigation of Performance and Repairability of Additively Printed Functional Circuits With Water-Based Silver Ink on an Inkjet Platform
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Topics: Circuits, Inks, Silver, Water, Printing, Manufacturing, Adhesives, Electronic circuits, Electronics, Filters
Proceedings Papers

Functional Circuit Performance of Printable Formable Inks for In-Mold Electronics Applications

Pradeep Lall, Jinesh Narangaparambil, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A019, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112069
https://doi.org/10.1115/IPACK2023-112069
View Paper titled, Functional Circuit Performance of Printable Formable Inks for In-Mold Electronics Applications
Open the PDF for Functional Circuit Performance of Printable Formable Inks for In-Mold Electronics Applications in another window
Topics: Adhesives, Circuits, Electronics, Inks, Printing
Proceedings Papers

Component Attach Process Recipe and Performance on Aerosol Printed Sustainable Silver Ink

Pradeep Lall, Sabina Bimali, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A018, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112066
https://doi.org/10.1115/IPACK2023-112066
View Paper titled, Component Attach Process Recipe and Performance on Aerosol Printed Sustainable Silver Ink
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Topics: Adhesives, Aerosols, Failure, Inks, Printing, Shear (Mechanics), Silver, Sintering, Stress, Sustainability
Proceedings Papers

Evaluation of Additive Circuits Printed With Sustainable Aqueous Silver Inks Using Aerosol Jet Printing and Gravure Offset Printing and Investigation of Circuit Repairability

Pradeep Lall, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A013, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112058
https://doi.org/10.1115/IPACK2023-112058
View Paper titled, Evaluation of Additive Circuits Printed With Sustainable Aqueous Silver Inks Using Aerosol Jet Printing and Gravure Offset Printing and Investigation of Circuit Repairability
Open the PDF for Evaluation of Additive Circuits Printed With Sustainable Aqueous Silver Inks Using Aerosol Jet Printing and Gravure Offset Printing and Investigation of Circuit Repairability in another window
Topics: Aerosols, Batteries, Circuits, Electronics, Inks, Offset printing, Printing, Silver, Sustainability