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Proceedings Papers

Effect of Thermal Characteristics of Electronic Enclosures on Dynamic Data Center Performance

Mahmoud Ibrahim, Siddharth Bhopte, Bahgat Sammakia, Bruce Murray, Madhusudan Iyengar, Roger Schmidt
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 411-420, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-40914
https://doi.org/10.1115/IMECE2010-40914
View Paper titled, Effect of Thermal Characteristics of Electronic Enclosures on Dynamic Data Center Performance
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Topics: Data centers, Temperature, Buoyancy, Computer simulation, Computers, Air conditioning, Boundary-value problems, Computational fluid dynamics, Cooling, Dynamics (Mechanics)
Proceedings Papers

Numerical Study on the Reduction of Recirculation Using Sealed Cold Aisles and its Effect on the Efficiency of the Cooling Infrastructure

Mahmoud Ibrahim, Bahgat Sammakia, Siddharth Bhopte, Bruce Murray, Madhusudan Iyengar, Roger Schmidt
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 585-593, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52166
https://doi.org/10.1115/IPACK2011-52166
View Paper titled, Numerical Study on the Reduction of Recirculation Using Sealed Cold Aisles and its Effect on the Efficiency of the Cooling Infrastructure
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Topics: Cooling, Electronic equipment, Temperature, Ceilings, Data centers, Energy dissipation, Heat, Sealing (Process), Air conditioning, Air flow
Proceedings Papers

Power Allocation Towards Hermetic Solder Joint Health of High Powered MEMS Chip for Harsh Environment Applications

Siddharth Bhopte, Parthiban Arunasalam, Fadi Alsaleem, Arvind Rao, Nataraj Hariharan
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 617-625, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52296
https://doi.org/10.1115/IPACK2011-52296
View Paper titled, Power Allocation Towards Hermetic Solder Joint Health of High Powered MEMS Chip for Harsh Environment Applications
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Topics: Microelectromechanical systems, Solder joints, Solders, Actuators, Metals, Pressure sensors, Refrigeration, Reliability, Flow (Dynamics), Flow control
Journal Articles

Numerical and Experimental Study of the Effect of Underfloor Blockages on Data Center Performance

Siddharth Bhopte, Bahgat Sammakia, Madhusudan Iyengar, Roger Schmidt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011007.
https://doi.org/10.1115/1.4003603
Published Online: March 9, 2011
View Article titled, Numerical and Experimental Study of the Effect of Underfloor Blockages on Data Center Performance
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Topics: Data centers, Flow (Dynamics), Pipes, Tiles, Computer simulation, Air flow
Proceedings Papers

An Integrated Nano-Structured Heat Spreader for High Heat Flux Electronic Systems

Siddharth Bhopte, Seshu B. Desu, Bahgat Sammakia
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 629-635, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22918
https://doi.org/10.1115/IHTC14-22918
View Paper titled, An Integrated Nano-Structured Heat Spreader for High Heat Flux Electronic Systems
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Topics: Electronic systems, Flat heat pipes, Heat flux, Heat, Thermal conductivity, Design, Electronic packages, Thermal management, Carbon, Dimensions
Proceedings Papers

Experimental Investigation of the Impact of Under Floor Blockages on Flow Distribution in a Data Center Cell

Siddharth Bhopte, Bahgat Sammakia, Madhusudan K. Iyengar, Roger Schmidt
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 827-836, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33540
https://doi.org/10.1115/IPACK2007-33540
View Paper titled, Experimental Investigation of the Impact of Under Floor Blockages on Flow Distribution in a Data Center Cell
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Topics: Data centers, Flow (Dynamics), Tiles, Air conditioning, Computational fluid dynamics, Pipes, Air flow, Cables, Computer simulation, Computers
Proceedings Papers

Application of Split Flow Design Technique to Simple Microchannel Geometries for Enhanced Mixing

Siddharth Bhopte, Bahgat Sammakia, Bruce Murray
Proc. ASME. BIOMED2008, ASME 2008 3rd Frontiers in Biomedical Devices Conference, 19-20, June 18–20, 2008
Publisher: American Society of Mechanical Engineers
Paper No: BioMed2008-38096
https://doi.org/10.1115/BioMed2008-38096
View Paper titled, Application of Split Flow Design Technique to Simple Microchannel Geometries for Enhanced Mixing
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Topics: Engineering design processes, Flow (Dynamics), Microchannels, Design, Microelectromechanical systems, Microfluidics, Reynolds number
Proceedings Papers

Mixing Enhancement in Two-Component Microchannel Flow: Geometric and Pulsed Flow Effects

Siddharth Bhopte, Bahgat Sammakia, Bruce Murray
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 15-21, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-43387
https://doi.org/10.1115/IMECE2007-43387
View Paper titled, Mixing Enhancement in Two-Component Microchannel Flow: Geometric and Pulsed Flow Effects
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Topics: Flow (Dynamics), Microchannel flow, Microchannels, Cavities, Computational fluid dynamics, Geometry, Microelectromechanical systems, Microfluidics, Modeling, Reynolds number
Proceedings Papers

Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature

Siddharth Bhopte, Dereje Agonafer, Roger Schmidt, Bahgat Sammakia
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 33-41, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73027
https://doi.org/10.1115/IPACK2005-73027
View Paper titled, Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature
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Topics: Data centers, Optimization, Temperature, Design, Tiles, Ceilings, Failure, Heat, Stress, Thermal management
Proceedings Papers

Numerical Modeling of Data Center Clusters: Impact of Model Complexity

Siddharth Bhopte, Madhusudan K. Iyengar, Bahgat Sammakia, Roger Schmidt, Dereje Agonafer
Proc. ASME. IMECE2006, Heat Transfer, Volume 3, 51-60, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-13494
https://doi.org/10.1115/IMECE2006-13494
View Paper titled, Numerical Modeling of Data Center Clusters: Impact of Model Complexity
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Topics: Computer simulation, Data centers, Flow (Dynamics), Computational fluid dynamics, Computers, Tiles, Air conditioning, Air flow, Cables, Cooling
Proceedings Papers

Guidelines on Managing Under Floor Blockages for Improved Data Center Performance

Siddharth Bhopte, Bahgat Sammakia, Madhusudan K. Iyengar, Roger Schmidt
Proc. ASME. IMECE2006, Heat Transfer, Volume 3, 83-91, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-13711
https://doi.org/10.1115/IMECE2006-13711
View Paper titled, Guidelines on Managing Under Floor Blockages for Improved Data Center Performance
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Topics: Data centers, Flow (Dynamics), Thermal management, Tiles, Air conditioning, Air flow, Computational fluid dynamics, Computers, Cooling, Design
Journal Articles

Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature

Siddharth Bhopte, Dereje Agonafer, Roger Schmidt, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 380–387.
https://doi.org/10.1115/1.2356866
Published Online: January 5, 2006
View Article titled, Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature
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Topics: Ceilings, Data centers, Optimization, Temperature, Design
Journal Articles

Mixed Convection of Impinging Air Cooling Over Heat Sink in Telecom System Application

Siddharth Bhopte, Musa S. Alshuqairi, Dereje Agonafer, Fellow ASME, Gamal Refai-Ahmed, Fellow ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 519–523.
https://doi.org/10.1115/1.1827267
Published Online: January 24, 2005
View Article titled, Mixed Convection of Impinging Air Cooling Over Heat Sink in Telecom System Application
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Topics: Heat sinks, Mixed convection, Reynolds number, Nozzles, Cooling, Computer simulation, Heat, Flow (Dynamics), Rayleigh number