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Steve Erasmus
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Proceedings Papers

DSC, TMA, DMA, and TGA of Epoxies for Fiber-Optic Transceiver Applications

John Lau, Steve Erasmus, Fred Sporon-Fiedler, Chris Chang
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 163-168, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24720
https://doi.org/10.1115/IMECE2001/EPP-24720
View Paper titled, DSC, TMA, DMA, and TGA of Epoxies for Fiber-Optic Transceiver Applications
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Topics: Epoxy adhesives, Epoxy resins, Fibers, Absorption, Glass transition, Hardening (Curing), Materials properties, Storage, Temperature
Proceedings Papers

Stress and Deflection Analysis of a Glass Window (Circular Plate) Elastically Restrained Along Its Edge in a Photonic Device

John H. Lau, Steve Erasmus, Yida Zou
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 165-172, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39491
https://doi.org/10.1115/IMECE2002-39491
View Paper titled, Stress and Deflection Analysis of a Glass Window (Circular Plate) Elastically Restrained Along Its Edge in a Photonic Device
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Topics: Deflection, Glass, Photonic equipment, Stress, Elastic constants, Geometry, Pressure, Temperature, Design, Double refraction
Journal Articles

Thermal Stress and Deflection Analysis of a Glass Window (Circular Plate) Elastically Restrained Along its Edge in a Photonic Device

John H. Lau, Fellow ASME, Steve Erasmus, Yida Zou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 602–608.
https://doi.org/10.1115/1.1604807
Published Online: December 15, 2003
View Article titled, Thermal Stress and Deflection Analysis of a Glass Window (Circular Plate) Elastically Restrained Along its Edge in a Photonic Device
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Topics: Deflection, Glass, Stress, Boundary-value problems, Pressure, Temperature, Double refraction, Thermal stresses
Journal Articles

Advantages and Disadvantages of Thin Small Outline Packages (TSOP) With Copper Gull-Wing Leads

John Lau, Suresh Golwalkar, Steve Erasmus
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 1994, 116(3): 234–237.
https://doi.org/10.1115/1.2905691
Published Online: September 1, 1994
View Article titled, Advantages and Disadvantages of Thin Small Outline Packages (TSOP) With Copper Gull-Wing Leads
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Topics: Copper, Wings, Alloys, Manufacturing, Solder joints, Stress
Journal Articles

Reliability of Fine Pitch Plastic Quad Flat Pack Leads and Solder Joints Under Bending, Twisting, and Thermal Conditions

John Lau, Steve Erasmus
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1993, 115(3): 322–328.
https://doi.org/10.1115/1.2909335
Published Online: September 1, 1993
View Article titled, Reliability of Fine Pitch Plastic Quad Flat Pack Leads and Solder Joints Under Bending, Twisting, and Thermal Conditions
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Topics: Reliability, Solder joints, Corners (Structural elements), Fatigue, Fatigue life, Finite element methods, Solders, Stress, Thermal stresses