1-16 of 16
Sukwon Choi
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Thermophysical Property Measurement of GaN-on-AlN Wafers for Next-Generation RF Device Technologies

Husam Walwil, Daniel C. Shoemaker, Yiwen Song, Kyuhwe Kang, Nathaniel S. McIlwaine, Michael L. Schuette, James S. Tweedie, Scott T. Sheppard, Jon-Paul Maria, Sukwon Choi
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140195
https://doi.org/10.1115/IPACK2024-140195
View Paper titled, Thermophysical Property Measurement of GaN-on-AlN Wafers for Next-Generation RF Device Technologies
Open the PDF for Thermophysical Property Measurement of GaN-on-AlN Wafers for Next-Generation RF Device Technologies in another window
Topics: Electrical conductance, Gallium nitride, High-electron-mobility transistors, Semiconductor wafers, Thermal conductivity, Thermoreflectance
Journal Articles

Special Issue on InterPACK2022

Jin Yang, Sukwon Choi, Benjamin Leever, Cheng Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. December 2023, 145(4): 040301.
Paper No: EP-23-1077
https://doi.org/10.1115/1.4063893
Published Online: November 1, 2023
View Articletitled, Special Issue on InterPACK2022
Open the PDF for Special Issue on InterPACK2022 in another window
Topics: Aerosols, Artificial intelligence, Cloud computing, Cooling, Cycles, Density, Electric vehicles, Electronic packaging, Electronics, Energy conversion
Journal Articles

Special Section on InterPACK2021

Jin Yang, Przemyslaw Gromala, Sukwon Choi, Damena Agonafer, Patrick McCluskey
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. March 2023, 145(1): 010301.
Paper No: EP-22-1094
https://doi.org/10.1115/1.4056558
Published Online: January 11, 2023
View Articletitled, Special Section on InterPACK2021
Open the PDF for Special Section on InterPACK2021 in another window
Topics: Additive manufacturing, Artificial intelligence, Data centers, Electronic packaging, Electronics, Engineering teachers, Integrated circuit packaging, Integrated circuits, Microelectromechanical systems, Microelectronic devices
Proceedings Papers

Experimental Probing of the Bias Dependent Self-Heating in AlGaN/GaN HEMTs With a Transparent Indium Tin Oxide Gate

Anwarul Karim, Tae Kyoung Kim, Daniel Shoemaker, Yiwen Song, Joon Seop Kwak, Sukwon Choi
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-98800
https://doi.org/10.1115/IPACK2022-98800
View Paper titled, Experimental Probing of the Bias Dependent Self-Heating in AlGaN/GaN HEMTs With a Transparent Indium Tin Oxide Gate
Open the PDF for Experimental Probing of the Bias Dependent Self-Heating in AlGaN/GaN HEMTs With a Transparent Indium Tin Oxide Gate in another window
Topics: Gallium nitride, Gates (Closures), Heating, Reliability, Temperature, Transparency
Journal Articles

Special Issue on InterPACK2020

Jin Yang, Sukwon Choi, Jaeho Lee, Saket Karajgikar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2022, 144(2): 020301.
Paper No: EP-21-1158
https://doi.org/10.1115/1.4053122
Published Online: January 4, 2022
View Articletitled, Special Issue on InterPACK2020
Open the PDF for Special Issue on InterPACK2020 in another window
Topics: Additive manufacturing, Cloud computing, Computers, Data centers, Electric vehicles, Electronic packaging, Electronics, Engineering teachers, Microelectronic packaging, Modeling
Journal Articles

Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging

Ronald J. Warzoha, Adam A. Wilson, Brian F. Donovan, Nazli Donmezer, Ashutosh Giri, Patrick E. Hopkins, Sukwon Choi, Darshan Pahinkar, Jingjing Shi, Samuel Graham, Zhiting Tian, Laura Ruppalt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020804.
Paper No: EP-20-1070
https://doi.org/10.1115/1.4049293
Published Online: February 22, 2021
View Articletitled, Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging
Open the PDF for Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging in another window
Topics: Electronics, Gallium nitride, Heat, Nanoscale phenomena, Phonons, Temperature, Thermal conductivity, Electromagnetic scattering, Energy gap, Diamonds
Journal Articles

Special Issue on InterPACK 2019 – Part 1

Sreekant Narumanchi, Sukwon Choi, Saket Karajgikar, Haiding Sun, Guangsheng Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. September 2020, 142(3): 030301.
Paper No: EP-20-1092
https://doi.org/10.1115/1.4048039
Published Online: August 14, 2020
View Articletitled, Special Issue on InterPACK 2019 – Part 1
Open the PDF for Special Issue on InterPACK 2019 – Part 1 in another window
Topics: Cloud computing, Electric vehicles, Electronic packaging, Electronics, Energy conversion, Engineering teachers, Feedback, Internet of things, Manufacturing, Mechanical engineers
Journal Articles

The Doping Dependence of the Thermal Conductivity of Bulk Gallium Nitride Substrates

Yiwen Song, James Spencer Lundh, Weijie Wang, Jacob H. Leach, Devon Eichfeld, Anusha Krishnan, Carlos Perez, Dong Ji, Trent Borman, Kevin Ferri, Jon-Paul Maria, Srabanti Chowdhury, Jae-Hyun Ryou, Brian M. Foley, Sukwon Choi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041112.
Paper No: EP-20-1014
https://doi.org/10.1115/1.4047578
Published Online: July 10, 2020
View Articletitled, The Doping Dependence of the Thermal Conductivity of Bulk Gallium Nitride Substrates
Open the PDF for The Doping Dependence of the Thermal Conductivity of Bulk Gallium Nitride Substrates in another window
Topics: Gallium nitride, Thermal conductivity, Phonons, Raman spectroscopy, Steady state, Thermoreflectance
Journal Articles

A System to Package Perspective on Transient Thermal Management of Electronics

H. Peter de Bock, David Huitink, Patrick Shamberger, James Spencer Lundh, Sukwon Choi, Nicholas Niedbalski, Lauren Boteler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041111.
Paper No: EP-20-1028
https://doi.org/10.1115/1.4047474
Published Online: June 29, 2020
View Articletitled, A System to Package Perspective on Transient Thermal Management of Electronics
Open the PDF for A System to Package Perspective on Transient Thermal Management of Electronics in another window
Topics: Transients (Dynamics), Thermal management, Design, Phase change materials, Temperature, Heat
Journal Articles

Device-Level Multidimensional Thermal Dynamics With Implications for Current and Future Wide Bandgap Electronics

James Spencer Lundh, Yiwen Song, Bikramjit Chatterjee, Albert G. Baca, Robert J. Kaplar, Andrew M. Armstrong, Andrew A. Allerman, Brianna A. Klein, Dustin Kendig, Hyungtak Kim, Sukwon Choi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031113.
Paper No: EP-20-1012
https://doi.org/10.1115/1.4047100
Published Online: May 21, 2020
View Articletitled, Device-Level Multidimensional Thermal Dynamics With Implications for Current and Future Wide Bandgap Electronics
Open the PDF for Device-Level Multidimensional Thermal Dynamics With Implications for Current and Future Wide Bandgap Electronics in another window
Topics: Dynamics (Mechanics), Electronics, Energy gap, Gallium nitride, Heating, Imaging, Steady state, Temperature, Temperature measurement, Thermal characterization
Journal Articles

Characterization of the Interdependence Between the Light Output and Self-Heating of Gallium Nitride Light-Emitting Diodes

Bikramjit Chatterjee, James Spencer Lundh, Daniel Shoemaker, Tae Kyoung Kim, Hoyeon Kim, Noel C. Giebnik, Joon Seop Kwak, Jaehee Cho, Sukwon Choi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031111.
Paper No: EP-20-1015
https://doi.org/10.1115/1.4047015
Published Online: May 13, 2020
View Articletitled, Characterization of the Interdependence Between the Light Output and Self-Heating of Gallium Nitride Light-Emitting Diodes
Open the PDF for Characterization of the Interdependence Between the Light Output and Self-Heating of Gallium Nitride Light-Emitting Diodes in another window
Topics: Gallium nitride, Heating, Light-emitting diodes, Nanoparticles, Temperature, Temperature measurement, Microscopy
Journal Articles

Guidelines for Reduced-Order Thermal Modeling of Multifinger GaN HEMTs

Robert Pearson, Bikramjit Chatterjee, Samuel Kim, Samuel Graham, Alexander Rattner, Sukwon Choi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021012.
Paper No: EP-19-1087
https://doi.org/10.1115/1.4046620
Published Online: April 6, 2020
View Articletitled, Guidelines for Reduced-Order Thermal Modeling of Multifinger GaN HEMTs
Open the PDF for Guidelines for Reduced-Order Thermal Modeling of Multifinger GaN HEMTs in another window
Topics: Gallium nitride, Gates (Closures), Heat, Modeling, Temperature, Heat flux, Heating, Critical heat flux, Heart failure, Approximation
Proceedings Papers

Integrated Optical Probing of the Thermal Dynamics of Wide Bandgap Power Electronics

James Spencer Lundh, Yiwen Song, Bikram Chatterjee, Albert G. Baca, Robert J. Kaplar, Andrew M. Armstrong, Andrew A. Allerman, Hyungtak Kim, Sukwon Choi
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A014, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6440
https://doi.org/10.1115/IPACK2019-6440
View Paper titled, Integrated Optical Probing of the Thermal Dynamics of Wide Bandgap Power Electronics
Open the PDF for Integrated Optical Probing of the Thermal Dynamics of Wide Bandgap Power Electronics in another window
Topics: Dynamics (Mechanics), Electron mobility, Electronics, Energy gap, Gallium nitride, Heating, Imaging, Temperature measurement, Thermoreflectance, Transistors
Proceedings Papers

Correlated Effects of Self-Heating, Light Output, and Efficiency of GaN Light-Emitting Diodes on Junction Temperature

Bikramjit Chatterjee, James Spencer Lundh, Daniel Shoemaker, Tae Kyoung Kim, Joon Seop Kwak, Jaehee Cho, Sukwon Choi
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A004, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6426
https://doi.org/10.1115/IPACK2019-6426
View Paper titled, Correlated Effects of Self-Heating, Light Output, and Efficiency of GaN Light-Emitting Diodes on Junction Temperature
Open the PDF for Correlated Effects of Self-Heating, Light Output, and Efficiency of GaN Light-Emitting Diodes on Junction Temperature in another window
Topics: Gallium nitride, Heating, Junctions, Light-emitting diodes, Temperature, Brightness (Photometry), Indium gallium nitride, Nanoparticles, Quantum wells, Temperature measurement
Journal Articles

Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications

Seung Kyu Oh, James Spencer Lundh, Shahab Shervin, Bikramjit Chatterjee, Dong Kyu Lee, Sukwon Choi, Joon Seop Kwak, Jae-Hyun Ryou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2019, 141(2): 020801.
Paper No: EP-18-1026
https://doi.org/10.1115/1.4041813
Published Online: February 25, 2019
View Articletitled, Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications
Open the PDF for Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications in another window
Topics: Energy gap, Gallium nitride, Light-emitting diodes, Photonic equipment, Semiconductors (Materials), Temperature, Temperature measurement, Thermal management, Thermography, Automotive industry
Proceedings Papers

Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes

Georges Pavlidis, James Dallas, Sukwon Choi, Shyh-Chiang Shen, Samuel Graham
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A011, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74149
https://doi.org/10.1115/IPACK2017-74149
View Paper titled, Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes
Open the PDF for Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes in another window
Topics: Gallium nitride, Steady state, Thermal characterization, Transients (Dynamics), Temperature, Sapphire, Temperature distribution, Heating, Imaging, Joules