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Suresh K. Sitaraman
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Proceedings Papers

Parametric Thermal Design for Heterogeneously Integrated High-Power Packages

Yunhyeok Im, Junyoung Kim, Mingeun Choi, Myriam Bouzidi, Xingchen Li, Joon Woo Kim, Ahmet Mete Muslu, Satish Kumar, Madhavan Swaminathan, Suresh K. Sitaraman, Yogendra Joshi
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141216
https://doi.org/10.1115/IPACK2024-141216
View Paper titled, Parametric Thermal Design for Heterogeneously Integrated High-Power Packages
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Topics: Cooling, Design, Silicon
Journal Articles

The Resistor Network Approach to Modeling Screen-Printed Silver Ink Under Uniaxial Stretch

Justin H. Chow, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041104.
Paper No: EP-23-1035
https://doi.org/10.1115/1.4063485
Published Online: October 9, 2023
View Article titled, The Resistor Network Approach to Modeling Screen-Printed Silver Ink Under Uniaxial Stretch
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Topics: Inks, Particulate matter, Percolation theory, Resistors, Silver, Modeling
Proceedings Papers

Thermal Management in Direct Chip Attach Assemblies

Daniel F. Baldwin, James T. Beerensson, Suresh K. Sitaraman
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 29-37, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0887
https://doi.org/10.1115/IMECE1996-0887
View Paper titled, Thermal Management in Direct Chip Attach Assemblies
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Topics: Thermal management, Adhesives, Electronics, Anisotropy, Design, Energy dissipation, Flip-chip, Flip-chip assemblies, Flip-chip devices, Junctions
Journal Articles

Mandrel Bend Test of Screen-Printed Silver Conductors

Rui Chen, Justin Chow, Yi Zhou, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031004.
Paper No: EP-22-1072
https://doi.org/10.1115/1.4056530
Published Online: January 11, 2023
View Article titled, Mandrel Bend Test of Screen-Printed Silver Conductors
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Topics: Cycles, Flexible electronics, Silver, Reliability, Inks, Damage, Imaging
Proceedings Papers

Mechanics Issues at Micro-Scale Modeling of Electronic Packages

Raghuram V. Pucha, Gnyaneshwar Ramakrishna, Suresh K. Sitaraman
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 73-82, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24709
https://doi.org/10.1115/IMECE2001/EPP-24709
View Paper titled, Mechanics Issues at Micro-Scale Modeling of Electronic Packages
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Topics: Cycles, Deformation, Electronic packages, Electronic packaging, Fatigue, Fatigue life, Materials properties, Microscale devices, Modeling, Plasticity
Proceedings Papers

Thermal Cycling Guidelines for Automotive, Computer, Portable, and Implantable Medical Device Applications

Rajiv Raghunathan, Raghuram V. Pucha, Suresh K. Sitaraman
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 51-62, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2246
https://doi.org/10.1115/IMECE2000-2246
View Paper titled, Thermal Cycling Guidelines for Automotive, Computer, Portable, and Implantable Medical Device Applications
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Topics: Computers, Medical devices, Flip-chip, Manufacturing, Automotive industry, Cycles, Damage, Density, Fatigue damage, Solders
Journal Articles

Correlation Studies Between Laser Ultrasonic Inspection Data and Finite-Element Modeling Results in Evaluation of Solder Joint Quality in Microelectronic Packages

Vishnu V. B. Reddy, Saurabh Gupta, Jaimal Williamson, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011009.
Paper No: EP-20-1126
https://doi.org/10.1115/1.4050898
Published Online: August 6, 2021
View Article titled, Correlation Studies Between Laser Ultrasonic Inspection Data and Finite-Element Modeling Results in Evaluation of Solder Joint Quality in Microelectronic Packages
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Topics: Cycles, Damage, Finite element analysis, Inspection, Lasers, Modeling, Natural language interfaces, Solders, Accelerated life testing, Density
Journal Articles

Mechanical Characterization of Embedded Serpentine Conductors in Wearable Electronics

Chong Ye, Charles I. Ume, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021007.
Paper No: EP-19-1085
https://doi.org/10.1115/1.4046163
Published Online: March 9, 2020
View Article titled, Mechanical Characterization of Embedded Serpentine Conductors in Wearable Electronics
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Topics: Carbon, Electronics, Finite element analysis, Polymers, Strips, Simulation, Textiles, Mechanical properties
Journal Articles

Examination of Consistent Application of Interfacial Fracture Energy Versus Mode-Mixity Curve for Delamination Prediction

David Samet, V. N. N. Trilochan Rambhatla, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021001.
Paper No: EP-19-1032
https://doi.org/10.1115/1.4045706
Published Online: February 3, 2020
View Article titled, Examination of Consistent Application of Interfacial Fracture Energy Versus Mode-Mixity Curve for Delamination Prediction
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Topics: Failure, Fracture (Materials), Fracture (Process), Delamination, Cantilevers
Journal Articles

Determination of Energy Release Rate Through Sequential Crack Extension

Scott McCann, Gregory T. Ostrowicki, Anh Tran, Timothy Huang, Tobias Bernhard, Rao R. Tummala, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041003.
Paper No: EP-17-1033
https://doi.org/10.1115/1.4037334
Published Online: August 25, 2017
View Article titled, Determination of Energy Release Rate Through Sequential Crack Extension
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Topics: Fracture (Materials), Thin films, Copper
Proceedings Papers

A Compliance-Based Approach to Study Fatigue Crack Propagation for a Copper-Epoxy Interface

David Samet, Abhishek Kwatra, Suresh K. Sitaraman
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A012, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48447
https://doi.org/10.1115/IPACK2015-48447
View Paper titled, A Compliance-Based Approach to Study Fatigue Crack Propagation for a Copper-Epoxy Interface
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Topics: Copper, Epoxy adhesives, Epoxy resins, Fatigue cracks, Fracture (Materials), Crack propagation, Fatigue, Cycles, Design, Displacement
Journal Articles

Impact Isolation Through the Use of Compliant Interconnects for Microelectronic Packages

Wei Chen, Anirudh Bhat, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041005.
Paper No: EP-14-1064
https://doi.org/10.1115/1.4031680
Published Online: October 12, 2015
View Article titled, Impact Isolation Through the Use of Compliant Interconnects for Microelectronic Packages
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Topics: Displacement, Manufacturing, Polymers, Simulation, Testing, Accelerometers, Engineering simulation, Strain gages, Finite element analysis, Engineering prototypes
Proceedings Papers

Fabrication of Second-Level TriDelta Interconnects Using Negative Dry-Film Photoresist

Wei Chen, Yaqin Song, Jiaxing Liang, Suresh K. Sitaraman
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A041, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-40154
https://doi.org/10.1115/IMECE2014-40154
View Paper titled, Fabrication of Second-Level TriDelta Interconnects Using Negative Dry-Film Photoresist
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Topics: Manufacturing, Photoresists, Design, Semiconductor wafers, Silicon, Displacement, Liquid films, Stress
Proceedings Papers

Strain Monitoring Near Through Silicon Vias Using Metal Piezoresistive Sensors

Christine Taylor, Xi Liu, Suresh K. Sitaraman
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A042, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-40041
https://doi.org/10.1115/IMECE2014-40041
View Paper titled, Strain Monitoring Near Through Silicon Vias Using Metal Piezoresistive Sensors
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Topics: Metals, Sensors, Silicon, Stress, Packaging, Energy consumption, Engineering simulation, Finite element analysis, Gages, High temperature
Proceedings Papers

Cohesive Zone Models to Predict Multiple White Bumps in Flip-Chip Assemblies

Sathyanarayanan Raghavan, Ilko Schmadlak, George Leal, Suresh K. Sitaraman
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A080, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-40199
https://doi.org/10.1115/IMECE2014-40199
View Paper titled, Cohesive Zone Models to Predict Multiple White Bumps in Flip-Chip Assemblies
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Topics: Flip-chip assemblies, Failure, Finite element model, Fracture (Process), Fracture mechanics, Microelectronic devices, Stress, Adhesives, Delamination, Dielectric materials
Proceedings Papers

Crowd-Funding for Inspiring Graduate Students to Educate K12 Students About STEM

Christine Taylor, Suresh K. Sitaraman
Proc. ASME. IMECE2014, Volume 5: Education and Globalization, V005T05A039, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-40039
https://doi.org/10.1115/IMECE2014-40039
View Paper titled, Crowd-Funding for Inspiring Graduate Students to Educate K12 Students About STEM
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Topics: Graduate students, Students, Electronic packaging, Nanotechnology, Cracking (Materials), Damage, Electrical engineering, Electronic packages, Engineering disciplines, Fracture (Process)
Journal Articles

Investigation of Dual Electrical Paths for Off-Chip Compliant Interconnects

Raphael Okereke, Karan Kacker, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 031004.
Paper No: EP-12-1102
https://doi.org/10.1115/1.4024112
Published Online: June 4, 2013
View Article titled, Investigation of Dual Electrical Paths for Off-Chip Compliant Interconnects
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Topics: Manufacturing, Reliability, Stress, Thermomechanics, Displacement, Semiconductor wafers, Copper, Simulation, Solders
Proceedings Papers

Reliable Design of TSV in Free-Standing Wafers and 3D Integrated Packages

Xi Liu, Margaret Simmons-Matthews, Kurt P. Wachtler, Suresh K. Sitaraman
Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 903-910, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-65767
https://doi.org/10.1115/IMECE2011-65767
View Paper titled, Reliable Design of TSV in Free-Standing Wafers and 3D Integrated Packages
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Topics: Design, Semiconductor wafers, Reliability, Silicon, Thermomechanics, Experimental design, Finite element analysis, Integrated circuits, Packaging, Semiconductor industry
Proceedings Papers

Parallel-Path Compliant Structures as Electrical Interconnects

Raphael Okereke, Karan Kacker, Suresh K. Sitaraman
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 479-485, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-38376
https://doi.org/10.1115/IMECE2010-38376
View Paper titled, Parallel-Path Compliant Structures as Electrical Interconnects
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Topics: Contamination, Design, Dielectric materials, Dimensions, Failure, Fatigue, Flip-chip devices, Fracture (Materials), Manufacturing, Oxidation
Proceedings Papers

Reliable Design of Electroplated Copper Through Silicon Vias

Xi Liu, Qiao Chen, Venkatesh Sundaram, Sriram Muthukumar, Rao R. Tummala, Suresh K. Sitaraman
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 497-506, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-39283
https://doi.org/10.1115/IMECE2010-39283
View Paper titled, Reliable Design of Electroplated Copper Through Silicon Vias
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Topics: Copper, Design, Silicon, Stress, Reliability, Manufacturing, Thermomechanics, Cracking (Materials), Deformation, Electroplating