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Suzana Prstic
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Proceedings Papers

Fundamental Study of Polymer to Metal Bonding in Integrated Circuit Packaging

Dinesh P. R. Thanu, Roozbeh Danaei, Alexander Bermudez, Sergio A. Chan, Suzana Prstic
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, August 27–30, 2018
Paper No: IPACK2018-8254
https://doi.org/10.1115/IPACK2018-8254
View Paper titled, Fundamental Study of Polymer to Metal Bonding in Integrated Circuit Packaging
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Topics: Integrated circuit packaging, Metal bonding, Polymers, Bonding, Manufacturing, Metals, Adhesion, Warping, Adhesives, Chemistry
Proceedings Papers

Performances of Silicon Micro-Flow-Passage Cold Plates From Single-Phase to Two-Phase With Water and HFE-7100 as Working Fluids

Tao Tong, Je-Young Chang, Shankar Devasenathipathy, John Dirner, Suzana Prstic, Ravi Prasher
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 95-110, November 11–15, 2007
Paper No: IMECE2007-42027
https://doi.org/10.1115/IMECE2007-42027
View Paper titled, Performances of Silicon Micro-Flow-Passage Cold Plates From Single-Phase to Two-Phase With Water and HFE-7100 as Working Fluids
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Topics: Flow (Dynamics), Fluids, Plates (structures), Silicon, Water, Boiling, Design, Microchannels, Pressure, Visualization
Proceedings Papers

High-Speed Visualization of Phase-Change Processes in Silicon Microchannels With Water and HFE-7100 as Working Fluids

Tao Tong, Je-Young Chang, Shankar Devasenathipathy, John Dirner, Suzana Prstic, Ravi Prasher
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 111-120, November 11–15, 2007
Paper No: IMECE2007-42028
https://doi.org/10.1115/IMECE2007-42028
View Paper titled, High-Speed Visualization of Phase-Change Processes in Silicon Microchannels With Water and HFE-7100 as Working Fluids
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Topics: Fluids, Microchannels, Silicon, Visualization, Water, Flow (Dynamics), Evaporation, Heat flux, Boiling, Density
Proceedings Papers

Theta_JC Metrology Development: Fixture Design Modeling

Michael Butch M. Dizon, Suzana Prstic, Sung-Won Moon
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 569-576, July 17–22, 2005
Paper No: IPACK2005-73405
https://doi.org/10.1115/IPACK2005-73405
View Paper titled, Theta_JC Metrology Development: Fixture Design Modeling
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Topics: Design, Metrology, Modeling, Errors, Computational fluid dynamics, Heat losses, Insulation, Junctions, Temperature, Cavities
Proceedings Papers

Thermal Performance of Vapor Chambers Under Hot Spot Heating Conditions

Je-Young Chang, Unnikrishnan Vadakkan, Ravi Prasher, Suzana Prstic
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 197-203, July 17–22, 2005
Paper No: IPACK2005-73131
https://doi.org/10.1115/IPACK2005-73131
View Paper titled, Thermal Performance of Vapor Chambers Under Hot Spot Heating Conditions
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Topics: Heating, Vapors, Copper, Boundary-value problems, Cooling, Heat, Heat conduction, Heat flux, Heat pipes, Heat transfer
Proceedings Papers

Convective Performance of Package Based Single Phase Microchannel Heat Exchanger

Je-Young Chang, Ravi Prasher, David Chau, Alan Myers, John Dirner, Suzana Prstic, Dongming He
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 183-188, July 17–22, 2005
Paper No: IPACK2005-73126
https://doi.org/10.1115/IPACK2005-73126
View Paper titled, Convective Performance of Package Based Single Phase Microchannel Heat Exchanger
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Topics: Heat exchangers, Microchannels, Heating, Temperature sensors, Cooling, Fluids, Heat flux, Heat transfer, Integrated circuits, Junctions
Proceedings Papers

Thermal Resistance and Pressure Drop of Silicon Based Micro Pin Fin Heat Exchanger Under Cross Flow

Ravi S. Prasher, John Dirner, Je-Young Chang, Alan Myers, David Chau, Dongming He, Suzana Prstic
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 717-725, July 17–22, 2005
Paper No: IPACK2005-73086
https://doi.org/10.1115/IPACK2005-73086
View Paper titled, Thermal Resistance and Pressure Drop of Silicon Based Micro Pin Fin Heat Exchanger Under Cross Flow
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Topics: Cross-flow, Heat exchangers, Pressure drop, Silicon, Thermal resistance, Dimensions, Fins, Fluids, Friction, Pins (Engineering)
Proceedings Papers

Effect of Localized Hotspot on the Thermal Performance of Two-Phase Microchannel Heat Exchanger

Ravi S. Prasher, John Dirner, Je-Young Chang, Alan Myers, David Chau, Suzana Prstic, Dongming He
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 99-103, July 17–22, 2005
Paper No: IPACK2005-73087
https://doi.org/10.1115/IPACK2005-73087
View Paper titled, Effect of Localized Hotspot on the Thermal Performance of Two-Phase Microchannel Heat Exchanger
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Topics: Heat exchangers, Microchannels, Heating, Boiling, Cooling, Heat, Heat transfer, Temperature sensors, Wall temperature
Journal Articles

Evaporative Thermal Performance of Vapor Chambers Under Nonuniform Heating Conditions

Je-Young Chang, Ravi S. Prasher, Suzana Prstic, P. Cheng, H. B. Ma
Journal: Journal of Heat Transfer
Article Type: Research Papers
J. Heat Transfer. December 2008, 130(12): 121501.
https://doi.org/10.1115/1.2976786
Published Online: September 23, 2008
View Article titled, Evaporative Thermal Performance of Vapor Chambers Under Nonuniform Heating Conditions
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Topics: Copper, Heat flux, Heating, Silicon, Vapors, Thermal resistance, Heat, Heat pipes
Proceedings Papers

Rheological Study of Micro Particle Laden Polymeric Thermal Interface Materials: Part 1 — Experimental

Ravi S. Prasher, Jim Shipley, Suzana Prstic, Paul Koning, Jin-Lin Wang
Proc. ASME. IMECE2002, Heat Transfer, Volume 7, 47-51, November 17–22, 2002
Paper No: IMECE2002-32117
https://doi.org/10.1115/IMECE2002-32117
View Paper titled, Rheological Study of Micro Particle Laden Polymeric Thermal Interface Materials: Part 1 — Experimental
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Topics: Microparticles, Rheology, Particulate matter, Polymers, Thermal conductivity, Viscosity, Computer cooling, Materials properties, Pressure, Thermal resistance
Proceedings Papers

Rheological Study of Micro Particle Laden Polymeric Thermal Interface Materials: Part 2 — Modeling

Ravi S. Prasher, Jim Shipley, Suzana Prstic, Paul Koning, Jin-Lin Wang
Proc. ASME. IMECE2002, Heat Transfer, Volume 7, 53-59, November 17–22, 2002
Paper No: IMECE2002-32118
https://doi.org/10.1115/IMECE2002-32118
View Paper titled, Rheological Study of Micro Particle Laden Polymeric Thermal Interface Materials: Part 2 — Modeling
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Topics: Microparticles, Modeling, Particulate matter, Pressure, Rheology, Thermal conductivity, Thermal resistance, Yield stress
Proceedings Papers

Thermal Resistance of Particle Laden Polymeric Thermal Interface Materials

Ravi S. Prasher, Jim Shipley, Suzana Prstic, Paul Koning, Jin-Lin Wang
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 431-439, November 15–21, 2003
Paper No: IMECE2003-41034
https://doi.org/10.1115/IMECE2003-41034
View Paper titled, Thermal Resistance of Particle Laden Polymeric Thermal Interface Materials
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Topics: Particulate matter, Thermal resistance, Polymers, Thermal conductivity, Design, Computer cooling, Fillers (Materials), Materials properties, Modeling, Optimization
Proceedings Papers

Nusselt Number and Friction Factor of Staggered Arrays of Low Aspect Ratio Micro-Pin-Fins Under Cross Flow for Water as Fluid

Ravi S. Prasher, John Dirner, Je-Young Chang, Alan Myers, David Chau, Dongming He, Suzana Prstic
Proc. ASME. IMECE2006, Heat Transfer, Volume 3, 9-20, November 5–10, 2006
Paper No: IMECE2006-13140
https://doi.org/10.1115/IMECE2006-13140
View Paper titled, Nusselt Number and Friction Factor of Staggered Arrays of Low Aspect Ratio Micro-Pin-Fins Under Cross Flow for Water as Fluid
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Topics: Cross-flow, Fins, Fluids, Friction, Water, Plates (structures), Reynolds number, Dimensions, Pins (Engineering), Shapes
Proceedings Papers

Performance of Two-Phase Microchannels at Sub-Atmospheric Pressure

Tao Tong, Shankar Devasenathipathy, Je-Young Chang, John Dirner, Suzana Prstic, Ravi S. Prasher
Proc. ASME. IMECE2006, Heat Transfer, Volume 2, 183-192, November 5–10, 2006
Paper No: IMECE2006-13144
https://doi.org/10.1115/IMECE2006-13144
View Paper titled, Performance of Two-Phase Microchannels at Sub-Atmospheric Pressure
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Topics: Microchannels, Pressure, Flow (Dynamics), Boiling, Pressure drop, Water temperature, Cooling, Fluids, Heat, Heat transfer
Journal Articles

Nusselt Number and Friction Factor of Staggered Arrays of Low Aspect Ratio Micropin-Fins Under Cross Flow for Water as Fluid

Ravi S. Prasher, John Dirner, Je-Young Chang, Alan Myers, David Chau, Dongming He, Suzana Prstic
Journal: Journal of Heat Transfer
Article Type: Research Papers
J. Heat Transfer. February 2007, 129(2): 141–153.
https://doi.org/10.1115/1.2402179
Published Online: April 13, 2006
View Article titled, Nusselt Number and Friction Factor of Staggered Arrays of Low Aspect Ratio Micropin-Fins Under Cross Flow for Water as Fluid
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Topics: Cross-flow, Fins, Fluids, Friction, Pins (Engineering), Plates (structures), Thermal resistance, Water, Flow (Dynamics), Temperature sensors
Journal Articles

“Heat Shield”—An Enhancement Device for an Unshrouded, Forced Convection Heat Sink

Suzana Prstic, Avram Bar-Cohen
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 172–176.
https://doi.org/10.1115/1.2188955
Published Online: February 16, 2006
View Article titled, “Heat Shield”—An Enhancement Device for an Unshrouded, Forced Convection Heat Sink
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Topics: Heat shielding, Heat sinks, Flow (Dynamics), Pressure drop
Journal Articles

Thermal Resistance of Particle Laden Polymeric Thermal Interface Materials

Ravi S. Prasher, Jim Shipley, Suzana Prstic, Paul Koning, Jin-lin Wang
Journal: Journal of Heat Transfer
Article Type: Technical Papers
J. Heat Transfer. December 2003, 125(6): 1170–1177.
https://doi.org/10.1115/1.1621893
Published Online: November 19, 2003
View Article titled, Thermal Resistance of Particle Laden Polymeric Thermal Interface Materials
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Topics: Fluids, Particulate matter, Polymers, Rheology, Thermal conductivity, Thermal resistance, Viscosity, Yield stress, Modeling, Pressure