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Journal Articles

Convective Performance of C5-Flouroketone-Based (C5-FK) and C4-Flouronitrile-Based (C4-FN) Gas Mixtures and SF 6

J. Korbel, J. Ostrowski, P. Stoller, F. Agostini, T. Braun, M. Bujotzek, M. Richter
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. January 2023, 15(1): 011002.
Paper No: TSEA-21-1686
https://doi.org/10.1115/1.4055330
Published Online: September 22, 2022
View Article titled, Convective Performance of C5-Flouroketone-Based (C5-FK) and C4-Flouronitrile-Based (C4-FN) Gas Mixtures and SF 6
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Topics: Computational fluid dynamics, Heat, Simulation, Temperature, Circuit breakers, Density, Carbon dioxide
Journal Articles

Nondestructive Failure Analysis and Simulation of Encapsulated 0402 Multilayer Ceramic Chip Capacitors Under Thermal and Mechanical Loading

B. Wunderle, T. Braun, D. May, B. Michel, H. Reichl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011012.
https://doi.org/10.1115/1.3078187
Published Online: February 13, 2009
View Article titled, Nondestructive Failure Analysis and Simulation of Encapsulated 0402 Multilayer Ceramic Chip Capacitors Under Thermal and Mechanical Loading
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Topics: Capacitors, Ceramics, Fracture (Materials), Capacitance, Simulation
Journal Articles

A New Wafer Level Packaging Approach: Encapsulation, Metallization and Laser Structuring for Advanced System in Package Manufacturing

K.-F. Becker, T. Braun, A. Neumann, A. Ostmann, E. Coko, M. Koch, V. Bader, R. Aschenbrenner, H. Reichl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 1–6.
https://doi.org/10.1115/1.1846058
Published Online: March 21, 2005
View Article titled, A New Wafer Level Packaging Approach: Encapsulation, Metallization and Laser Structuring for Advanced System in Package Manufacturing
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Topics: Lasers, Manufacturing, Packaging, Reliability, Semiconductor wafers, System-in-package, Flip-chip devices, Epoxy adhesives, Epoxy resins