1-20 of 30
Tien-Yu Tom Lee
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool

Tien-Yu Tom Lee, Ravi Sharma, André Peyre-Lavigne
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 339-345, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1108
https://doi.org/10.1115/IMECE1997-1108
View Paper titled, Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool
Open the PDF for Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool in another window
Topics: Carbon monoxide, Computational fluid dynamics, Design, Sensors, Steady state, Transients (Dynamics), Cooling, Cycles, Electrical measurement, Energy consumption
Proceedings Papers

Integrated Transient Thermal and Mechanical Analysis of Molded PBGA Packages During Thermal Shock

Lei L. Mercado, Tien-Yu Tom Lee, Jeff Cook
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 111-119, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0924
https://doi.org/10.1115/IMECE1999-0924
View Paper titled, Integrated Transient Thermal and Mechanical Analysis of Molded PBGA Packages During Thermal Shock
Open the PDF for Integrated Transient Thermal and Mechanical Analysis of Molded PBGA Packages During Thermal Shock in another window
Topics: Thermal shock, Transients (Dynamics), Computational fluid dynamics, Stress, Boundary-value problems, Ball-Grid-Array packaging, Flip-chip, Heat transfer, Heat transfer coefficients, Molded plastics
Proceedings Papers

Design Analysis of an Electroless Plating Bath Using CFD Technique

Tien-Yu Tom Lee, Jong-Kai Lin
Proc. ASME. IMECE99, Heat Transfer: Volume 3, 381-388, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-1095
https://doi.org/10.1115/IMECE1999-1095
View Paper titled, Design Analysis of an Electroless Plating Bath Using CFD Technique
Open the PDF for Design Analysis of an Electroless Plating Bath Using CFD Technique in another window
Topics: Computational fluid dynamics, Design, Electroless plating, Flow (Dynamics), Semiconductor wafers, Diffusers, Fluids, Momentum, Nickel, Plating
Proceedings Papers

An Investigation of Thermal Enhancement on Flip Chip Plastic BGA Packages Using CFD Tool

Tien-Yu Tom Lee
Proc. ASME. IMECE99, Heat Transfer: Volume 1, 21-28, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0966
https://doi.org/10.1115/IMECE1999-0966
View Paper titled, An Investigation of Thermal Enhancement on Flip Chip Plastic BGA Packages Using CFD Tool
Open the PDF for An Investigation of Thermal Enhancement on Flip Chip Plastic BGA Packages Using CFD Tool in another window
Topics: Ball-Grid-Array packages, Computational fluid dynamics, Flip-chip, Flip-chip devices, Flat heat pipes, Heat sinks, Heat transfer, Aluminum, Copper, Flip-chip packages
Proceedings Papers

Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance

Victor Adrian Chiriac, Tien -Yu Tom Lee
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 93-100, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24382
https://doi.org/10.1115/IMECE2001/HTD-24382
View Paper titled, Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance
Open the PDF for Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance in another window
Topics: Design, Gallium arsenide, Temperature, Thermal conductivity, Metals, Computer simulation, Junctions, Microelectronic devices, Packaging, Reliability
Proceedings Papers

A Novel Cooling Enhancement in Microelectronic Devices and Systems Using Oscillatory Impinging Air Jets

Victor Adrian Chiriac, Tien -Yu Tom Lee, Jorge Luis Rosales
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 81-89, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24381
https://doi.org/10.1115/IMECE2001/HTD-24381
View Paper titled, A Novel Cooling Enhancement in Microelectronic Devices and Systems Using Oscillatory Impinging Air Jets
Open the PDF for A Novel Cooling Enhancement in Microelectronic Devices and Systems Using Oscillatory Impinging Air Jets in another window
Topics: Air jets, Cooling, Microelectronic devices, Heat transfer, Channel flow, Flow (Dynamics), High temperature, Reynolds number, Buckling, Engineering simulation
Proceedings Papers

Thermal Design Analysis of Free Space Optical Interconnect (FSOI) Package Module

Victor Adrian Chiriac, Tien-Yu Tom Lee
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 163-170, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24389
https://doi.org/10.1115/IMECE2001/HTD-24389
View Paper titled, Thermal Design Analysis of Free Space Optical Interconnect (FSOI) Package Module
Open the PDF for Thermal Design Analysis of Free Space Optical Interconnect (FSOI) Package Module in another window
Topics: Design, Optical interconnections, Vacuum, Temperature, Ceramics, Lumber, Copper, Manufacturing, Cavities, Computer software
Proceedings Papers

Transient Thermal Analysis of an Anisotropic Conductive Film Package Assembly Process

Victor Adrian Chiriac, Tien-Yu Tom Lee
Proc. ASME. IMECE2000, Manufacturing Engineering, 453-459, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1840
https://doi.org/10.1115/IMECE2000-1840
View Paper titled, Transient Thermal Analysis of an Anisotropic Conductive Film Package Assembly Process
Open the PDF for Transient Thermal Analysis of an Anisotropic Conductive Film Package Assembly Process in another window
Topics: Anisotropy, Manufacturing, Thermal analysis, Transients (Dynamics), Temperature, Computational fluid dynamics, Hardening (Curing), Convection, Cooling, Heat conduction
Proceedings Papers

Mechanical Characterization of Gold Bonding Wires With Different Doping at Extreme Temperatures

Dave S. Mahadevan, Vern Hause, Tien-Yu Tom Lee
Proc. ASME. IMECE2000, Manufacturing Engineering, 467-471, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1842
https://doi.org/10.1115/IMECE2000-1842
View Paper titled, Mechanical Characterization of Gold Bonding Wires With Different Doping at Extreme Temperatures
Open the PDF for Mechanical Characterization of Gold Bonding Wires With Different Doping at Extreme Temperatures in another window
Topics: Bonding, Temperature, Wire, Stress, Elongation, Extruding, Strength (Materials)
Proceedings Papers

Thermal Investigation of Interconnect Technologies for GaAs RF Power Amplifier in Handheld Applications

Tien-Yu Tom Lee, Victor A. Chiriac
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 671-677, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33844
https://doi.org/10.1115/IPACK2007-33844
View Paper titled, Thermal Investigation of Interconnect Technologies for GaAs RF Power Amplifier in Handheld Applications
Open the PDF for Thermal Investigation of Interconnect Technologies for GaAs RF Power Amplifier in Handheld Applications in another window
Topics: Gallium arsenide, Wire, Flip-chip, Flip-chip devices, Simulation, Design, Heat, Heat transfer, Solders, Vehicles
Proceedings Papers

A New Resistor-Capacitor (RC) Transient Thermal Network Approach for Power Amplifier Module in Handheld Telecommunication

Youmin Yu, Victor Adrian Chiriac, Tien-Yu Tom Lee
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 783-790, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33335
https://doi.org/10.1115/IPACK2007-33335
View Paper titled, A New Resistor-Capacitor (RC) Transient Thermal Network Approach for Power Amplifier Module in Handheld Telecommunication
Open the PDF for A New Resistor-Capacitor (RC) Transient Thermal Network Approach for Power Amplifier Module in Handheld Telecommunication in another window
Topics: Capacitors, Resistors, Telecommunications, Transients (Dynamics), Temperature, Cycles, Heat, Topology, Curve fitting, Simulation
Proceedings Papers

Thermal Performance Evaluation and Enhancement for an Automotive Wireless Application Incorporating Multiple Dynamic Heat Sources

Victor Chiriac, Tien-Yu Tom Lee
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 233-239, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33705
https://doi.org/10.1115/IPACK2007-33705
View Paper titled, Thermal Performance Evaluation and Enhancement for an Automotive Wireless Application Incorporating Multiple Dynamic Heat Sources
Open the PDF for Thermal Performance Evaluation and Enhancement for an Automotive Wireless Application Incorporating Multiple Dynamic Heat Sources in another window
Topics: Computer simulation, Heat, Performance evaluation, Transients (Dynamics), Cycles, Heat budget (Physics), Signals, Copper, Design, Dynamic systems
Proceedings Papers

System Level Thermal Optimization of an Automotive Lightning Module Incorporating Several Power Devices

Victor Chiriac, Tien-Yu Tom Lee
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 241-247, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33707
https://doi.org/10.1115/IPACK2007-33707
View Paper titled, System Level Thermal Optimization of an Automotive Lightning Module Incorporating Several Power Devices
Open the PDF for System Level Thermal Optimization of an Automotive Lightning Module Incorporating Several Power Devices in another window
Topics: Lightning, Optimization, Energy dissipation, Temperature, Design, Pins (Engineering), Heat, Heat budget (Physics), Junctions, Automotive industry
Proceedings Papers

A Conjugate Numerical-RC Network Prediction of the Transient Thermal Response of a Power Amplifier Module in Handheld Telecommunication

Tien-Yu Tom Lee, Victor A. Chiriac, Roger Stout
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 105-112, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73090
https://doi.org/10.1115/IPACK2005-73090
View Paper titled, A Conjugate Numerical-RC Network Prediction of the Transient Thermal Response of a Power Amplifier Module in Handheld Telecommunication
Open the PDF for A Conjugate Numerical-RC Network Prediction of the Transient Thermal Response of a Power Amplifier Module in Handheld Telecommunication in another window
Topics: Telecommunications, Transients (Dynamics), Cycles, Steady state, Temperature, Waves, Junctions, Capacitors, Computation, Computer software
Proceedings Papers

System-Level Transient Thermal Analysis for Performance Optimization of High Power Microelectronics

Victor Adrian Chiriac, Tien-Yu Tom Lee, H. S. Chen
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 435-442, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35213
https://doi.org/10.1115/IPACK2003-35213
View Paper titled, System-Level Transient Thermal Analysis for Performance Optimization of High Power Microelectronics
Open the PDF for System-Level Transient Thermal Analysis for Performance Optimization of High Power Microelectronics in another window
Topics: Microelectronic devices, Optimization, Thermal analysis, Transients (Dynamics), Temperature, Cycles, Design, Computer software, Cooling, Flow (Dynamics)
Proceedings Papers

System and Package Level Thermal Optimization of Power Amplifier Modules With Application in Wireless Communication

Victor Adrian Chiriac, Tien-Yu Tom Lee, David Lutz
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 443-450, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35216
https://doi.org/10.1115/IPACK2003-35216
View Paper titled, System and Package Level Thermal Optimization of Power Amplifier Modules With Application in Wireless Communication
Open the PDF for System and Package Level Thermal Optimization of Power Amplifier Modules With Application in Wireless Communication in another window
Topics: Optimization, Temperature, Elastomers, Design, Slug flows, Computer software, Copper, Failure, High temperature, Numerical analysis
Proceedings Papers

Performance Comparison of Mesoscale Refrigeration Technologies for Electronics Packaging

Patrick E. Phelan, Victor Chiriac, Tien-Yu Tom Lee
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 309-315, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35140
https://doi.org/10.1115/IPACK2003-35140
View Paper titled, Performance Comparison of Mesoscale Refrigeration Technologies for Electronics Packaging
Open the PDF for Performance Comparison of Mesoscale Refrigeration Technologies for Electronics Packaging in another window
Topics: Electronic packaging, Refrigeration, Compression, Vapors, Compressors, Cycles, Microelectronic devices, Thermoelectric coolers
Proceedings Papers

Microelectronic Cooling Techniques Using Single and Dual Oscillatory Impinging Air Jets

Victor Adrian Chiriac, Tien-Yu Tom Lee, Jorge Luis Rosales
Proc. ASME. IMECE2002, Heat Transfer, Volume 7, 171-178, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39243
https://doi.org/10.1115/IMECE2002-39243
View Paper titled, Microelectronic Cooling Techniques Using Single and Dual Oscillatory Impinging Air Jets
Open the PDF for Microelectronic Cooling Techniques Using Single and Dual Oscillatory Impinging Air Jets in another window
Topics: Air jets, Cooling, Heat transfer, Jets, Flow (Dynamics), Temperature, Flat heat pipes, Heat sinks, Manufacturing, Microelectronic devices
Proceedings Papers

Process-Induced Thermal Effect on Packaging Yield of RF MEMS Switches

Lei L. Mercado, Shun-Meen Kuo, Tien-Yu Tom Lee, Russ Lee
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 25-32, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39266
https://doi.org/10.1115/IMECE2002-39266
View Paper titled, Process-Induced Thermal Effect on Packaging Yield of RF MEMS Switches
Open the PDF for Process-Induced Thermal Effect on Packaging Yield of RF MEMS Switches in another window
Topics: Microelectromechanical systems, Packaging, Switches, Temperature effects, Failure mechanisms, Cantilevers, Contact resistance, Design, Electrodes, Engineering simulation
Proceedings Papers

RF MEMS Switch Heat Dissipation in Discrete and Wafer-Level MEMS Packages

Lei L. Mercado, Tien-Yu Tom Lee, Shun-Meen Kuo, Vern Hause, Craig Amrine
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 15-24, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39265
https://doi.org/10.1115/IMECE2002-39265
View Paper titled, RF MEMS Switch Heat Dissipation in Discrete and Wafer-Level MEMS Packages
Open the PDF for RF MEMS Switch Heat Dissipation in Discrete and Wafer-Level MEMS Packages in another window
Topics: Energy dissipation, Heat, MEMS packages, Microelectromechanical systems, Semiconductor wafers, Switches