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Journal Articles

Predicting Heat Transfer From Unsteady Synthetic Jets

Mehmet Arik, Tunc Icoz

Publisher: ASME

J. Heat Mass Transfer. August 2012, 134(8): 081901.

https://doi.org/10.1115/1.4005740

Published Online: May 31, 2012

View Article titled, Predicting Heat Transfer From Unsteady Synthetic Jets

Topics: Heat transfer, Jets, Pressure measurement

Proceedings Papers

Low Frequency Piezoelectric Synthetic Jets

Charles E. Seeley, Mehmet Arik, Yogen Uttukar, Tunc Icoz

Proc. ASME. SMASIS2010, ASME 2010 Conference on Smart Materials, Adaptive Structures and Intelligent Systems, Volume 1, 619-626, September 28–October 1, 2010

Publisher: American Society of Mechanical Engineers

Paper No: SMASIS2010-3822

https://doi.org/10.1115/SMASIS2010-3822

View Paper titled, Low Frequency Piezoelectric Synthetic Jets

Topics: Jets, Fluid structure interaction, Cooling, Computational fluid dynamics, Design, Degrees of freedom, Electronics, Finite element analysis, Heat, Heat transfer

Proceedings Papers

Thermal Characteristics of a Synthetic Jet Integrated Heat Sink Design for Air-Cooled Electronics

Yogen Utturkar, Mehmet Arik, Tunc Icoz

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 973-984, July 19–23, 2009

Publisher: American Society of Mechanical Engineers

Paper No: InterPACK2009-89322

https://doi.org/10.1115/InterPACK2009-89322

View Paper titled, Thermal Characteristics of a Synthetic Jet Integrated Heat Sink Design for Air-Cooled Electronics

Topics: Design, Electronics, Heat sinks, Cooling, Air jets, Computer simulation, Condensation, Dynamics (Mechanics), Electronic systems, Energy dissipation

Proceedings Papers

Characterization of Light Weight Heat Sink Materials for Thermal Management of Electronics

Tunc Icoz, Mehmet Arik, John T. Dardis, II

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 619-625, July 8–12, 2007

Publisher: American Society of Mechanical Engineers

Paper No: IPACK2007-33216

https://doi.org/10.1115/IPACK2007-33216

View Paper titled, Characterization of Light Weight Heat Sink Materials for Thermal Management of Electronics

Topics: Electronics, Heat sinks, Thermal management, Weight (Mass), Advanced materials, Cooling, Anisotropy, Computer simulation, Design, Reliability

Proceedings Papers

Evaluation on Use of Thermoelectric Devices for Electronics Cooling

H. Peter J. De Bock, Tunc Icoz

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 199-203, July 8–12, 2007

Publisher: American Society of Mechanical Engineers

Paper No: IPACK2007-33154

https://doi.org/10.1115/IPACK2007-33154

View Paper titled, Evaluation on Use of Thermoelectric Devices for Electronics Cooling

Topics: Computer cooling, Thermoelectric devices, Cooling, Electronics, Thermoelectric cooling, Heat, Temperature, Coolers, Heat flux

Proceedings Papers

Optimization of Vortex Promoter Design Using a Dynamic Data Driven Approach

Tunc Icoz, Yogesh Jaluria

Proc. ASME. HT2005, Heat Transfer: Volume 4, 607-617, July 17–22, 2005

Publisher: American Society of Mechanical Engineers

Paper No: HT2005-72288

https://doi.org/10.1115/HT2005-72288

View Paper titled, Optimization of Vortex Promoter Design Using a Dynamic Data Driven Approach

Topics: Design, Electronic systems, Optimization, Simulation, Vortices

Proceedings Papers

Natural Convection From Protruding Heat Sources in a Channel

Tunc Icoz, Qinghua Wang, Yogesh Jaluria

Proc. ASME. HT2003, Heat Transfer: Volume 3, 541-550, July 21–23, 2003

Publisher: American Society of Mechanical Engineers

Paper No: HT2003-47419

https://doi.org/10.1115/HT2003-47419

View Paper titled, Natural Convection From Protruding Heat Sources in a Channel

Topics: Heat, Natural convection

Proceedings Papers

Design of Cooling Systems for Electronic Equipment Using Both Experimental and Numerical Inputs

Tunc Icoz, Yogesh Jaluria

Proc. ASME. IMECE2003, Heat Transfer, Volume 2, 205-210, November 15–21, 2003

Publisher: American Society of Mechanical Engineers

Paper No: IMECE2003-42098

https://doi.org/10.1115/IMECE2003-42098

View Paper titled, Design of Cooling Systems for Electronic Equipment Using Both Experimental and Numerical Inputs

Topics: Cooling systems, Design, Electronic equipment, Computer simulation, Computer cooling, Design methodology, Dimensions, Engineering simulation, Flow (Dynamics), Heat

Proceedings Papers

Effect of 3D Diffusion Over Vertical Thin Rectangular Geometries in Natural Convection Heat Transfer

Mustafa Gursoy, Mehmet Arik, Tunc Icoz, Michael Yovanovich, Theodorian Borca-Tasciuc

Proc. ASME. IMECE2006, Heat Transfer, Volume 3, 25-33, November 5–10, 2006

Publisher: American Society of Mechanical Engineers

Paper No: IMECE2006-13293

https://doi.org/10.1115/IMECE2006-13293

View Paper titled, Effect of 3D Diffusion Over Vertical Thin Rectangular Geometries in Natural Convection Heat Transfer

Topics: Diffusion (Physics), Heat transfer, Natural convection, Heat, Heat conduction, Rayleigh number, Vertical plates, Air entrainment, Convection, Fluid density

Journal Articles

Design Optimization of Size and Geometry of Vortex Promoter in a Two-Dimensional Channel

Tunc Icoz, Yogesh Jaluria

Publisher: ASME

J. Heat Mass Transfer. October 2006, 128(10): 1081–1092.

https://doi.org/10.1115/1.2345433

Published Online: July 8, 2006

View Article titled, Design Optimization of Size and Geometry of Vortex Promoter in a Two-Dimensional Channel

Topics: Design, Flow (Dynamics), Heat, Heat transfer, Optimization, Pressure drop, Vortices, Geometry

Journal Articles

Design of Air and Liquid Cooling Systems for Electronic Components Using Concurrent Simulation and Experiment

Tunc Icoz, Nitin Verma, Yogesh Jaluria

Publisher: ASME

J. Electron. Packag. December 2006, 128(4): 466–478.

https://doi.org/10.1115/1.2353284

Published Online: March 27, 2006

View Article titled, Design of Air and Liquid Cooling Systems for Electronic Components Using Concurrent Simulation and Experiment

Topics: Cooling, Design, Flow (Dynamics), Heat, Heat transfer, Optimization, Simulation, Computer simulation, Pressure drop, Cooling systems

Journal Articles

Design of Cooling Systems for Electronic Equipment Using Both Experimental and Numerical Inputs

Tunc Icoz, Yogesh Jaluria

Publisher: ASME

J. Electron. Packag. December 2004, 126(4): 465–471.

https://doi.org/10.1115/1.1827262

Published Online: January 24, 2005

View Article titled, Design of Cooling Systems for Electronic Equipment Using Both Experimental and Numerical Inputs

Topics: Computer simulation, Cooling systems, Design, Electronic equipment, Flow (Dynamics), Heat, Temperature, Turbulence, Cooling, Heat transfer

Journal citation

NARROW

Predicting Heat Transfer From Unsteady Synthetic Jets

Low Frequency Piezoelectric Synthetic Jets

Thermal Characteristics of a Synthetic Jet Integrated Heat Sink Design for Air-Cooled Electronics

Characterization of Light Weight Heat Sink Materials for Thermal Management of Electronics

Evaluation on Use of Thermoelectric Devices for Electronics Cooling

Optimization of Vortex Promoter Design Using a Dynamic Data Driven Approach

Natural Convection From Protruding Heat Sources in a Channel

Design of Cooling Systems for Electronic Equipment Using Both Experimental and Numerical Inputs

Effect of 3D Diffusion Over Vertical Thin Rectangular Geometries in Natural Convection Heat Transfer

Design Optimization of Size and Geometry of Vortex Promoter in a Two-Dimensional Channel

Design of Air and Liquid Cooling Systems for Electronic Components Using Concurrent Simulation and Experiment

Design of Cooling Systems for Electronic Equipment Using Both Experimental and Numerical Inputs

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