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Vern Hause
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Proceedings Papers

Mechanical Characterization of Gold Bonding Wires With Different Doping at Extreme Temperatures

Dave S. Mahadevan, Vern Hause, Tien-Yu Tom Lee
Proc. ASME. IMECE2000, Manufacturing Engineering, 467-471, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1842
https://doi.org/10.1115/IMECE2000-1842
View Paper titled, Mechanical Characterization of Gold Bonding Wires With Different Doping at Extreme Temperatures
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Topics: Bonding, Temperature, Wire, Stress, Elongation, Extruding, Strength (Materials)
Proceedings Papers

RF MEMS Switch Heat Dissipation in Discrete and Wafer-Level MEMS Packages

Lei L. Mercado, Tien-Yu Tom Lee, Shun-Meen Kuo, Vern Hause, Craig Amrine
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 15-24, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39265
https://doi.org/10.1115/IMECE2002-39265
View Paper titled, RF MEMS Switch Heat Dissipation in Discrete and Wafer-Level MEMS Packages
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Topics: Energy dissipation, Heat, MEMS packages, Microelectromechanical systems, Semiconductor wafers, Switches
Proceedings Papers

Thermal Performance Optimization of RF Packages for Wireless Communication

Victor Adrian Chiriac, Tien-Yu Tom Lee, Vern Hause
Proc. ASME. IMECE2003, Heat Transfer, Volume 2, 227-233, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42171
https://doi.org/10.1115/IMECE2003-42171
View Paper titled, Thermal Performance Optimization of RF Packages for Wireless Communication
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Topics: Optimization, Temperature, Junctions, Thermal resistance, Solders, Computer simulation, Design, Electrical conductivity, Epoxy adhesives, Epoxy resins
Journal Articles

Thermal Performance Optimization of Radio Frequency Packages for Wireless Communication

Victor Adrian Chiriac, Tien-Yu Tom Lee, Vern Hause
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 429–434.
https://doi.org/10.1115/1.1827257
Published Online: January 24, 2005
View Article titled, Thermal Performance Optimization of Radio Frequency Packages for Wireless Communication
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Topics: Heat, Junctions, Optimization, Solders, Temperature, Thermal conductivity, Thermal resistance, Epoxy adhesives, Epoxy resins, Numerical analysis