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Xiaoyuan He
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Proceedings Papers

A Window Based Graphics Interface for Phase Shifting Analysis in Moire Interferometry

Xiaoyuan He, Daqing Zou, Sheng Liu, Yifan Guo
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 97-103, November 16–21, 1997
Paper No: IMECE1997-1233
https://doi.org/10.1115/IMECE1997-1233
View Paper titled, A Window Based Graphics Interface for Phase Shifting Analysis in Moire Interferometry
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Topics: Interferometry, Displacement, Computer software, Phase diagrams, Computer programming, Deformation, Diffraction gratings, Electronic packages, Flip-chip
Proceedings Papers

Resolving Deformation Field Near Corners and Interfaces by Phase Shifting Moiré Interferometry

Daqing Zou, Xiaoyuan He, Sheng Liu, Yifan Guo, Fulong Dai
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 69-76, November 16–21, 1997
Paper No: IMECE1997-1229
https://doi.org/10.1115/IMECE1997-1229
View Paper titled, Resolving Deformation Field Near Corners and Interfaces by Phase Shifting Moiré Interferometry
Open the PDF for Resolving Deformation Field Near Corners and Interfaces by Phase Shifting Moiré Interferometry in another window
Topics: Corners (Structural elements), Deformation, Interferometry, Computer software, Electronic packaging, Failure, Flip-chip, Flip-chip packages, Image processing, Nanoscale phenomena
Proceedings Papers

Refined Micro Moire System and its Applications to Chip Scale and Flip-Chip Packages

Daqing Zou, Xiaoyuan He, Minfu Lu, Sheng Liu, Yifan Guo
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 59-64, November 15–20, 1998
Paper No: IMECE1998-0429
https://doi.org/10.1115/IMECE1998-0429
View Paper titled, Refined Micro Moire System and its Applications to Chip Scale and Flip-Chip Packages
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Topics: Circuits, Control equipment, Corners (Structural elements), Deformation, Density, Displacement, Electronic packages, Flip-chip, Flip-chip packages, Interferometers
Proceedings Papers

Automatic Warpage Measurement of Advanced Packages by Optical Method

Xiaoyuan He, Jiabin Dai, Sheng Liu
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 65-70, November 15–20, 1998
Paper No: IMECE1998-0430
https://doi.org/10.1115/IMECE1998-0430
View Paper titled, Automatic Warpage Measurement of Advanced Packages by Optical Method
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Topics: Warping, Deformation, Ball-Grid-Array packaging, Shapes, Computer software, Diffraction gratings, Imaging, Manufacturing, Modeling, Packaging