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Proceedings Papers

Dynamic Reduced Electrothermal Model for Integrated Power Electronics Modules (IPEM): Part I — Thermal Analysis

M. Herna´ndez-Mora, J. E. Gonza´lez, M. Ve´lez-Reyes, J. M. Orti´z, Y. Pang, E. Scott
Proc. ASME. IMECE2003, Heat Transfer, Volume 2, 291-298, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42446
https://doi.org/10.1115/IMECE2003-42446
View Paper titled, Dynamic Reduced Electrothermal Model for Integrated Power Electronics Modules (IPEM): Part I — Thermal Analysis
Open the PDF for Dynamic Reduced Electrothermal Model for Integrated Power Electronics Modules (IPEM): Part I — Thermal Analysis in another window
Topics: Electronics, Thermal analysis, Computer software, Transients (Dynamics), Capacitance, Heat transfer
Proceedings Papers

Assessment of Some Integrated Cooling Mechanisms for an Active IPEM

Y. Pang, E. Scott, J. D. van Wyk, Z. Liang
Proc. ASME. IMECE2004, Heat Transfer, Volume 2, 163-170, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-59342
https://doi.org/10.1115/IMECE2004-59342
View Paper titled, Assessment of Some Integrated Cooling Mechanisms for an Active IPEM
Open the PDF for Assessment of Some Integrated Cooling Mechanisms for an Active IPEM in another window
Topics: Cooling, Density, Electronics, Packaging, Thermal management
Journal Articles

Assessment of Some Integrated Cooling Mechanisms for an Active Integrated Power Electronics Module

Y. Pang, E. Scott, J. D. van Wyk, Z. Liang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 1–8.
https://doi.org/10.1115/1.2429703
Published Online: April 16, 2006
View Article titled, Assessment of Some Integrated Cooling Mechanisms for an Active Integrated Power Electronics Module
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Topics: Ceramics, Cooling, Electronics, Heat, Thermal conductivity, Temperature, Thermal management
Journal Articles

Dynamic Reduced Electrothermal Model for Integrated Power Electronics Modules (IPEM)

M. Herna´ndez-Mora, J. E. Gonza´lez, M. Ve´lez-Reyes, J. M. Ortiz-Rodrı´guez, Y. Pang, E. Scott
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 477–490.
https://doi.org/10.1115/1.1827264
Published Online: January 24, 2005
View Article titled, Dynamic Reduced Electrothermal Model for Integrated Power Electronics Modules (IPEM)
Open the PDF for Dynamic Reduced Electrothermal Model for Integrated Power Electronics Modules (IPEM) in another window
Topics: Capacitance, Electronics, Heat transfer, Simulation, Temperature, Thermal analysis, Transients (Dynamics), Computer software, Heat, Design
Journal Articles

Effect of Turbulent Heat Transfer on Continuous Ingot Solidification

W. Shyy, Y. Pang, G. B. Hunter, D. Y. Wei, M.-H. Chen
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Research Papers
J. Eng. Mater. Technol. January 1993, 115(1): 8–16.
https://doi.org/10.1115/1.2902163
Published Online: January 1, 1993
View Article titled, Effect of Turbulent Heat Transfer on Continuous Ingot Solidification
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Topics: Solidification, Turbulent heat transfer, Turbulence, Casting, Fluctuations (Physics), Temperature, Accounting, Buoyancy, Cathode ray oscilloscopes, Convection
Journal Articles

A Surface Rejuvenation Model for Turbulent Heat Transfer in Annular Flow With High Prandtl Numbers

B. T. F. Chung, L. C. Thomas, Y. Pang
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. February 1978, 100(1): 92–97.
https://doi.org/10.1115/1.3450509
Published Online: February 1, 1978
View Article titled, A Surface Rejuvenation Model for Turbulent Heat Transfer in Annular Flow With High Prandtl Numbers
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Topics: Flow (Dynamics), Turbulent heat transfer, Annulus, Eddies (Fluid dynamics), Energy dissipation, Fluids, Heat flux, Heat transfer, Prandtl number