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Y. C. Chan
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Proceedings Papers

Thermodynamic Assessment of Sn-Co-Cu Lead-Free Solder Alloy

Libin Liu, Cristina Andersson, Johan Liu, Y. C. Chan
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 141-145, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35126
https://doi.org/10.1115/IPACK2003-35126
View Paper titled, Thermodynamic Assessment of Sn-Co-Cu Lead-Free Solder Alloy
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Topics: Alloys, Lead-free solders, Phase diagrams, Tin
Journal Articles

Reliability of Anisotropic Conductive Film Joints Using Bumpless Chip—Influence of Reflow Soldering and Environmental Testing

W. K. Chiang, Y. C. Chan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 113–119.
https://doi.org/10.1115/1.1849236
Published Online: June 3, 2005
View Article titled, Reliability of Anisotropic Conductive Film Joints Using Bumpless Chip—Influence of Reflow Soldering and Environmental Testing
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Topics: Contact resistance, Reflow soldering, Reliability, Bonding, Adhesives, Temperature, Anisotropy, Testing
Journal Articles

Investigation of Conductive Adhesive Bonding Using UV Curable Anisotropic Conductive Adhesives at Different Curing Conditions

K. K. Lee, S. C. Tan, Y. C. Chan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 52–58.
https://doi.org/10.1115/1.1846068
Published Online: March 21, 2005
View Article titled, Investigation of Conductive Adhesive Bonding Using UV Curable Anisotropic Conductive Adhesives at Different Curing Conditions
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Topics: Adhesives, Bonding, Hardening (Curing), Shear (Mechanics), Ultraviolet radiation, Fourier transform infrared spectroscopy
Journal Articles

Behavior of Anisotropic Conductive Film (ACF) Joint under Mechanical Shock

Rashed Adnan Islam, Y. C. Chan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 375–380.
https://doi.org/10.1115/1.2056570
Published Online: February 14, 2005
View Article titled, Behavior of Anisotropic Conductive Film (ACF) Joint under Mechanical Shock
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Topics: Anisotropy, Contact resistance, Shock (Mechanics), Particulate matter, Abrasion
Journal Articles

Effect of Underfill Entrapment on the Reliability of Flip-Chip Solder Joint

Y. C. Chan, M. O. Alam, K. C. Hung, H. Lu, C. Bailey
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 541–545.
https://doi.org/10.1115/1.1756590
Published Online: January 24, 2005
View Article titled, Effect of Underfill Entrapment on the Reliability of Flip-Chip Solder Joint
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Topics: Bonding, Flip-chip, Flip-chip devices, Flow (Dynamics), Reliability, Solder joints, Solders, Modeling
Journal Articles

Comparative Study of the Dissolution Kinetics of Electrolytic Ni and Electroless NiP Layers by Molten Sn3.5Ag Solder Alloy

M. N. Islam, Y. C. Chan, M. O. Alam, A. Sharif
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 365–369.
https://doi.org/10.1115/1.2056567
Published Online: December 22, 2004
View Article titled, Comparative Study of the Dissolution Kinetics of Electrolytic Ni and Electroless NiP Layers by Molten Sn3.5Ag Solder Alloy
Open the PDF for Comparative Study of the Dissolution Kinetics of Electrolytic Ni and Electroless NiP Layers by Molten Sn3.5Ag Solder Alloy in another window
Topics: Solder joints, Solders, Stress, Tin, Alloys, Shear (Mechanics), Diffusion (Physics), Lead-free solders
Journal Articles

Electrical Conductive Characteristics of Anisotropic Conductive Adhesive Particles

G. B. Dou, Y. C. Chan, Johan Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 609–616.
https://doi.org/10.1115/1.1604808
Published Online: December 15, 2003
View Article titled, Electrical Conductive Characteristics of Anisotropic Conductive Adhesive Particles
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Topics: Particulate matter, Nickel
Journal Articles

Effect of Bonding Force on the Conducting Particle With Different Sizes

N. H. Yeung, Y. C. Chan, C. W. Tan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2003, 125(4): 624–629.
https://doi.org/10.1115/1.1604810
Published Online: December 15, 2003
View Article titled, Effect of Bonding Force on the Conducting Particle With Different Sizes
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Topics: Bonding, Particulate matter, Deformation, Finite element analysis, Stress, Particle size
Journal Articles

The Effect of Cooling Rate on the Growth of Cu-Sn Intermetallics in Annealed PBGA Solder Joints

Y. C. Chan, S. H. Fan, J. K. L. Lai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2003, 125(1): 153–156.
https://doi.org/10.1115/1.1537070
Published Online: March 14, 2003
View Article titled, The Effect of Cooling Rate on the Growth of Cu-Sn Intermetallics in Annealed PBGA Solder Joints
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Topics: Cooling, Crystallization, Diffusion (Physics), Intermetallic compounds, Solder joints, Solders, Tin, Temperature, Solidification, Ball-Grid-Array packaging
Journal Articles

Open Defects in PBGA Assembly Solder Joints

S. H. Fan, Y. C. Chan, J. K. L. Lai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2003, 125(1): 157–161.
https://doi.org/10.1115/1.1536951
Published Online: March 14, 2003
View Article titled, Open Defects in PBGA Assembly Solder Joints
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Topics: Manufacturing, Solder joints, Solders, Soldering, Inspection, Thermal stability, Wetting, Printing
Journal Articles

Correlation Between the Mechanical Strength and Curing Condition of No-Flow Flip Chip Assemblies

C. W. Tang, Y. C. Chan, K. C. Hung, P. L. Tu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 397–402.
https://doi.org/10.1115/1.1510865
Published Online: December 12, 2002
View Article titled, Correlation Between the Mechanical Strength and Curing Condition of No-Flow Flip Chip Assemblies
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Topics: Flip-chip devices, Flow (Dynamics), Shear strength, Tin, Heating, Flip-chip assemblies, Hardening (Curing), Solders, Manufacturing, Strength (Materials)
Journal Articles

An Investigation of Intermetallics Formation Between Pd/Ag Metallization and Sn/Pb/Ag Solder

G. Y. Li, Y. C. Chan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2002, 124(3): 305–310.
https://doi.org/10.1115/1.1486012
Published Online: July 26, 2002
View Article titled, An Investigation of Intermetallics Formation Between Pd/Ag Metallization and Sn/Pb/Ag Solder
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Topics: Electron diffraction, Intermetallic compounds, Solder joints, Solders, Tin, X-ray diffraction, Silver, X-rays, Transmission electron microscopy, Thick films
Journal Articles

Fatigue Lifetimes of PBGA Solder Joints Reflowed at Different Conveyor Speeds

S. H. Fan, Y. C. Chan, J. K. L. Lai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2001, 123(3): 290–294.
https://doi.org/10.1115/1.1347997
Published Online: July 14, 1999
View Article titled, Fatigue Lifetimes of PBGA Solder Joints Reflowed at Different Conveyor Speeds
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Topics: Conveyor systems, Cooling, Cycles, Fatigue, Shear (Mechanics), Solder joints, Solders, Ball-Grid-Array packaging, Heat transfer, Solidification
Journal Articles

Nondestructive Evaluation of Ceramic Substrate With Embedded Passive Components by SAM

Z. Q. Yu, Y. C. Chan, D. P. Webb, G. Y. Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 172–177.
https://doi.org/10.1115/1.483151
Published Online: May 21, 1999
View Article titled, Nondestructive Evaluation of Ceramic Substrate With Embedded Passive Components by SAM
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Topics: Acoustics, Capacitors, Ceramics, Delamination, Nondestructive evaluation, Testing, Microscopy, Thermal shock, Reliability, Failure analysis