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Proceedings Papers

Optimizing Closed-Loop Liquid Cooling Solution for Extreme High Power Multi-Packages

Arunima Panigrahy, Prabhakar Subrahmanyam, Ying-Feng Pang, Ridvan Sahan, Amy Xia
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A016, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73954
https://doi.org/10.1115/IPACK2021-73954
View Paper titled, Optimizing Closed-Loop Liquid Cooling Solution for Extreme High Power Multi-Packages
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Topics: Cooling, Heat exchangers, Power density
Proceedings Papers

Small Form Factor Peltier-Based Liquid Cooling for High Power Density Electronics

Arunima Panigrahy, Ying Feng Pang, Amy Xia, Victor P. Polyanko
Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A051, November 11–17, 2016
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2016-65680
https://doi.org/10.1115/IMECE2016-65680
View Paper titled, Small Form Factor Peltier-Based Liquid Cooling for High Power Density Electronics
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Topics: Cooling, Electronics, Power density, Thermoelectric coolers, Water, Density, Design, Manufacturing, Reliability, Temperature
Proceedings Papers

Advanced Liquid Cooling Technology Evaluation for High Power CPUs and GPUs

Ridvan A. Sahan, Rahima K. Mohammed, Amy Xia, Ying-Feng Pang
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 311-318, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52225
https://doi.org/10.1115/IPACK2011-52225
View Paper titled, Advanced Liquid Cooling Technology Evaluation for High Power CPUs and GPUs
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Topics: Cooling, Graphics processing units, Diamonds, Fins, Water, Design, Flow (Dynamics), Coolers, Electrolytic corrosion, Metals
Proceedings Papers

System Level Thermal Design Challenges in Validation Platforms

Rahima K. Mohammed, Ridvan A. Sahan, Ying-Feng Pang
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1077-1086, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89412
https://doi.org/10.1115/InterPACK2009-89412
View Paper titled, System Level Thermal Design Challenges in Validation Platforms
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Topics: Design, Cooling, Engineering simulation, Simulation, Computational fluid dynamics, Semiconductor industry, Silicon, Acoustics, Cables, Heating
Proceedings Papers

Experimental Study on the Double-Sided Air Cooling for Integrated Power Electronics Modules

Ying Feng Pang, Elaine P. Scott, Zhenxian Liang, J. D. van Wyk
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 393-400, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73272
https://doi.org/10.1115/IPACK2005-73272
View Paper titled, Experimental Study on the Double-Sided Air Cooling for Integrated Power Electronics Modules
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Topics: Cooling, Electronics, Heat, Heat sinks, Thermal management, Thermal resistance, Flat heat pipes, Flow (Dynamics), Junctions, Packaging
Proceedings Papers

Electrical and Thermal Layout Design and Optimization Considerations for DPS Active IPEM

Ying Feng Pang, Jonah Zhou Chen, Elaine P. Scott, Karen A. Thole
Proc. ASME. IMECE2002, Heat Transfer, Volume 7, 253-259, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-33778
https://doi.org/10.1115/IMECE2002-33778
View Paper titled, Electrical and Thermal Layout Design and Optimization Considerations for DPS Active IPEM
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Topics: Design, Optimization, Computational fluid dynamics, Electronics, Engineering simulation, Finite element analysis, Sensitivity analysis, Simulation, Temperature, Thermal analysis
Proceedings Papers

Thermal Characterization and Optimization of Active System IPEM

Ying-Feng Pang, Elaine P. Scott
Proc. ASME. IMECE2003, Heat Transfer, Volume 2, 161-166, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-41415
https://doi.org/10.1115/IMECE2003-41415
View Paper titled, Thermal Characterization and Optimization of Active System IPEM
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Topics: Optimization, Thermal characterization, Computer software, Design, Finite element analysis, Geometry
Proceedings Papers

The Effects of Various Cooling Scenarios on a System of Integrated Circuits

Dion L. Minter, Ying Feng Pang, Elaine P. Scott
Proc. ASME. IMECE2003, Heat Transfer, Volume 2, 167-173, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-41667
https://doi.org/10.1115/IMECE2003-41667
View Paper titled, The Effects of Various Cooling Scenarios on a System of Integrated Circuits
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Topics: Cooling, Integrated circuits, Forced convection, Heat conduction, Heat sinks, Heat transfer, Temperature
Journal Articles

Thermal Design and Optimization Methodology for Integrated Power Electronics Modules

Ying Feng Pang, Elaine P. Scott, Jonah Zhou Chen, Karen A. Thole
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 59–66.
https://doi.org/10.1115/1.1849233
Published Online: March 21, 2005
View Article titled, Thermal Design and Optimization Methodology for Integrated Power Electronics Modules
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Topics: Design, Thermal analysis, Temperature, Optimization