The increasing importance of improving efficiency and reducing capital costs has led to significant work studying advanced Brayton cycles for high temperature energy conversion. Using compact, highly efficient, diffusion-bonded heat exchangers for the recuperators has been a noteworthy improvement in the design of advanced carbon dioxide Brayton cycles. These heat exchangers will operate near the pseudocritical point of carbon dioxide, making use of the drastic variation of the thermophysical properties. This paper focuses on the experimental measurements of heat transfer under cooling conditions, as well as pressure drop characteristics within a prototypic printed circuit heat exchanger. Studies utilize type-316 stainless steel, nine channel, semi-circular test section, and supercritical carbon dioxide serves as the working fluid throughout all experiments. The test section channels have a hydraulic diameter of 1.16 mm and a length of 0.5 m. The mini-channels are fabricated using current chemical etching technology, emulating techniques used in current diffusion-bonded printed circuit heat exchanger manufacturing. Local heat transfer values were determined using measured wall temperatures and heat fluxes over a large set of experimental parameters that varied system pressure, inlet temperature, and mass flux. Experimentally determined heat transfer coefficients and pressure drop data are compared to correlations and earlier data available in literature. Modeling predictions using the computational fluid dynamics (CFD) package FLUENT are included to supplement experimental data. All nine channels were modeled using known inlet conditions and measured wall temperatures as boundary conditions. The CFD results show excellent agreement in total heat removal for the near pseudocritical region, as well as regions where carbon dioxide is a high or low density fluid.
Skip Nav Destination
Article navigation
September 2011
Research Papers
Heat Transfer of Supercritical Carbon Dioxide in Printed Circuit Heat Exchanger Geometries
Mark Anderson,
Mark Anderson
University of Wisconsin
, Madison
, WI 53711
Search for other works by this author on:
Roma Fatima,
Roma Fatima
Texas A&M University
, College Station, TX
77843
Search for other works by this author on:
Aaron Towne,
Aaron Towne
University of Wisconsin
, Madison
, WI 53711
Search for other works by this author on:
Devesh Ranjan
Devesh Ranjan
Texas A&M University
, College Station, TX
77843
Search for other works by this author on:
Mark Anderson
University of Wisconsin
, Madison
, WI 53711
Roma Fatima
Texas A&M University
, College Station, TX
77843
Aaron Towne
University of Wisconsin
, Madison
, WI 53711
Devesh Ranjan
Texas A&M University
, College Station, TX
77843J. Thermal Sci. Eng. Appl. Sep 2011, 3(3): 031002 (8 pages)
Published Online: August 10, 2011
Article history
Received:
May 11, 2010
Revised:
May 17, 2011
Online:
August 10, 2011
Published:
August 10, 2011
Citation
Kruizenga, A., Anderson, M., Fatima, R., Corradini, M., Towne, A., and Ranjan, D. (August 10, 2011). "Heat Transfer of Supercritical Carbon Dioxide in Printed Circuit Heat Exchanger Geometries." ASME. J. Thermal Sci. Eng. Appl. September 2011; 3(3): 031002. https://doi.org/10.1115/1.4004252
Download citation file:
Get Email Alerts
Cited By
Related Articles
Design of a 1 MWth Supercritical Carbon Dioxide Primary Heat Exchanger Test System
J. Energy Resour. Technol (September,2021)
Measurement of Convective Heat Transfer Coefficients With Supercritical CO 2 Using the Wilson-Plot Technique
J. Energy Resour. Technol (July,2020)
Thermodynamic Analysis of Part-Flow Cycle Supercritical CO 2 Gas Turbines
J. Eng. Gas Turbines Power (November,2010)
Theoretical and Experimental Study of a Flexible Wiretype Joule–Thomson Microrefrigerator for Use in Cryosurgery
J. Heat Transfer (February,2012)
Related Proceedings Papers
Related Chapters
Thermodynamic Performance
Closed-Cycle Gas Turbines: Operating Experience and Future Potential
Compressive Deformation of Hot-Applied Rubberized Asphalt Waterproofing
Roofing Research and Standards Development: 10th Volume
Thermal Design Guide of Liquid Cooled Systems
Thermal Design of Liquid Cooled Microelectronic Equipment